Проект |
съдържание |
Вид на продукта |
Strip-shaped solder pad, frame and substrate-type solder wire products |
Инспекционни елементи |
Die shedding, offset, die reversed, error, silver paste/foreign object, contamination, scratch, chipping, broken edge, die crack, insufficient silver paste, miss wire, ball shedding,abnormal ball, ball offset, 2nd bonding shedding, 2nd bonding offset, 2nd bonding abnormal, broken wire, wire bending, tail length, foreign object |
UPH |
40-80strips/H(Determined by the size of the material strip and the size of the die) |
Прецизност |
5 μm/пиксел |
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