Projekt |
sisu |
Toode Tüüp |
6",8",12" wafer, 2.5D/3D packaging |
2D Inspection Kirjed |
Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive needle marks, etc. |
2D Metrology |
Bump diameter, needle mark coordinates, RDL and TSV metrology, etc. |
3D Inspection Project |
Bump height, Bump coplanality |
Cassette &Transmission Method |
8"SMIF , 12" FOUP or combination |
Objektiiv ja eraldusvõime |
2x(2.75um)13.5x(1.57um)5x(1.1um)17.5x(0.73um)110x(0.55um) |
Täpsus |
0.55um/pixel |
Valikuline ja kohandatud |
Double sided OCR,3D module, supported by E84 |
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