Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle
  • Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle

Fully Automatic Die bonder suitable for Multi Chip Replaceable Suction Nozzle

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Product Description

Fully Automatic High-precision Replaceable Nozzle Die bonding machine

The fully automatic high-precision Dispensing Machine and Die bonding machine are key equipments for post packaging that can be combined online, with a positioning accuracy of+/-3um.
The machine adopts advanced motion control technology and modular design concept, with flexible and diverse configuration methods, suitable for multi chip bonding, providing flexible and fast solutions for microwave and millimeter wave fields, hybrid integrated circuit fields, discrete device fields, optoelectronics and other fields.
Die Bonder
Dispenser
Function
1. Programming is convenient, easy to learn, and effectively shortens the training cycle for personnel
2. For white ceramics, substrates with grooves, etc., the one-time success rate of image recognition is high, reducing manual intervention
3. 12 suction nozzles and 24 gel boxes can meet the mounting requirements of most microwave multi chip users
4. Real time monitoring of the current device's working status, material situation, nozzle application, etc. through the second display;
5. Automatic dispensing, automatic SMT station, free combination, multiple cascading machines, effectively improving production;
6. Multi program combination mode, which can quickly call existing subroutines
7. High precision exploration can reach 1um
8. Equipped with precision dispensing control and calibration device, the minimum glue point diameter can reach 0.2mm
9. Efficient mounting speed, with a production capacity of over 1500 components per hour (taking 0.5 * 0.5mm size as an example)
Product details
Sample
Specification
NO.
Component name
Index name
Detailed indicator description
1
Motion platform
Movement stroke
XYZ-250mm*320mm*50mm
Size of products that can be mounted
XYZ-200mm*170mm*50mm
Displacement resolution
XYZ-0.05um
Repeat positioning accuracy
XY axis: ±2um@3S
Z axis: ±0.3um
Maximum running speed of XY axis
XYZ=1m/s
Limit function
Electronic soft limit + physical limit
Rotation range of rotation axis θ
±360°
Rotation resolution of rotation axis θ
0.001°
Probing height method and accuracy
Mechanical height detection, 1um
Overall accuracy of patch
Patch accuracy ±3um@3S
Angle accuracy ±0.001°@3S
2
Force control system
Pressure range and resolution
5~1500g, 0.1g resolution
3
Optical system
Main PR camera
4.2mm*3.7mm field of view, support 500M pixels
Back recognition camera
4.2mm*3.7mm field of view, support 500M pixels
4
Nozzle system
Clamping method
Magnetic + vacuum
Number of nozzle changes
12
Auto-calibration and auto-switching of nozzles
Support online automatic calibration, automatic switching
Nozzle detection protection
Support
5
Calibration system
Back view camera calibration
Nozzle XYZ direction calibration
6
Functional features
Program compatibility
Product images and location information can be shared with the dispensing machine
Secondary identification
Possessing secondary recognition function for substrates
Multi-layer matrix nesting
Possessing multi-layer matrix nesting function for substrates
Second display function
Visually view material production status information
Switch of individual points can be set arbitrarily
Can set the switch of any component, and the parameters are independently adjustable
Support CAD import function
Product cavity depth
12mm
System connection
Support SMEMA communication
7
Patch module
Compatible with patches at different heights and angles
The program automatically switches nozzles and components
The chip picking parameters can be modified independently/in batches
The chip picking parameters include the approach height before chip picking, the approach speed of chip picking, the pressure of
chip picking, the height of chip picking, the speed of chip picking, the vacuum time and other parameters
The chip placement parameters can be modified independently/in batches
The chip placement parameters include the approach height before chip placement, the approach speed before chip placement, the
pressure of chip placement, the height of chip placement, the speed of chip placement, the vacuum time, the backflush time and
other parameters
Back recognition and calibration after chip picking
It can support the back recognition of chips in the size range of 0.2-25mm
Chip position center deviation
No more than ±3um@3S
Productivity efficiency
No less than 1500 components/hour (taking the chip size of 0.5*0.5mm as an example)
8
Material system
Compatible number of waffle boxes/gel boxes
Standard 2*2 inches 24 pieces
Each box bottom can be vacuumed
Vacuum platform can be customized
Vacuum adsorption area range can reach 200mm*170mm
Compatible chip size
Depends on the tip matching
Size: 0.2mm-25mm
Thickness: 30um-17mm
9
Equipment safety and environmental requirements
Air system
Device shape
Length*depth*height: 840*1220*2000mm
Device weight
760Kg
Power supply
220AC±10%@50Hz，10A
Temperature and humidity
Temperature: 25℃±5℃
Humidity: 30%RH～60%RH
Compressed air source (or nitrogen source as an alternative)
Pressure>0.2Mpa, flow>5LPM, purified air source
Vacuum
Pressure<-85Kpa, pumping speed>50LPM
N0.
Component name
Index name
Detailed indicator description
1
Motion platform
Movement stroke
XYZ-250mm*320mm*50mm
Size of mountable products
XYZ-200mm*170mm*50mm
Displacement resolution
XYZ-0.05um
Repeat positioning accuracy
XY axis: ±2um@3S
Z axis: ±0.3um
Maximum operating speed of XY axis
XYZ=1m/s
Limit function
Electronic soft limit + physical limit
Rotation range of rotation axis θ
±360°
Rotation resolution of rotation axis θ
0.001°
Probing height method and accuracy
Mechanical height detection, 1um, the height detection of any point can be set;
Overall dispensing accuracy
±3um@3S
2
Dispensing module
Minimum glue dot diameter
0.2mm (using 0.1mm diameter needle)
Dispensing mode
Pressure-time mode
High-precision dispensing pump, control valve, automatic adjustment of positive/negative dispensing pressure
Dispensing air pressure setting range
0.01-0.6MPa
Support dotting function, and parameters can be set arbitrarily
Parameters include dispensing height, pre-dispensing time, dispensing time, pre-collecting time, dispensing pressure and other
parameters
Support glue stripping function, and parameters can be set arbitrarily
Parameters include dispensing height, pre-dispensing time, glue speed, pre-collecting time, glue pressure and other parameters
High compatibility of dispensing
It has the ability to dispense glue on planes at different heights, and the glue type can be rotated at any angle
Custom glue stripping
The glue type library can be directly called and customized
3
Material system
Vacuum platform can be customized
Vacuum adsorption area range up to 200mm*170mm
Glue packaging (standard)
5CC (compatible with 3CC)
Pre-marked glue board
Can be used for parameter height of dotting and glue-scribing mode, and pre-scribing before glue-dispensing production
4
Calibration system
Glue needle calibration
Calibration of glue-dispensing needle XYZ direction
5
Optical system
Main PR camera
4.2mm*3.5mm field of view, 500M pixels
Identify substrate/component
Can normally identify common substrates and components, and special substrates can be customized with recognition function
6
Functional features
Program compatibility
Product images and location information can be shared with the placement machine
Chip position center deviation
No more than ±3um@3S
Productivity efficiency
No less than 1500 components/hour (taking 0.5*0.5mm chip size as an example)
Secondary identification
Has substrate secondary recognition function
Multi-layer matrix nesting
Has substrate multi-layer matrix nesting function
Second display function
Visually view material production status information
Switch of individual points can be set arbitrarily
Can set the switch of any component, and the parameters are independently adjustable
Support CAD import function
Product cavity depth
12mm
7
Equipment safety and environmental requirements
Gas system
Equipment shape
Length*depth*height: 840*1220*2000mm
Equipment weight
760Kg
Power supply
220AC±10%@50Hz, 10A
Temperature and humidity
Temperature: 25℃±5℃
Compressed air source (or nitrogen source as an alternative)
Humidity: 30%RH～60%RH
Vacuum
Pressure>0.2Mpa, flow>5LPM, purified air source
Packing & Delivery
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014，the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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