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  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder
  • MDHX-M6000 Multifunctional Wedge and Ball Wire bonder

MDHX-M6000 Multifunctional Wedge and Ball Wire bonder

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Product Description
MDHX-M6000 Multifunctional Wedge and Ball Wire Bonder

Equipment introduction

MDHX-M6000 multifunctional wedge and ball bonder is a manual bonding equipment used to connect the chip pads to the pads on the substrate or lead frame with platinum wire, gold wire/tape, aluminum wire, silver wire or copper wire. It is a semiconductor One of the key equipment necessary for the post-packaging process on the production line.
MDHX-M6000 bonding machine has two functional modes of ball welding and wedge welding. It adopts XYZ integrated operation handle and electric brake structure, which makes the equipment operation flexible and convenient; unique ultrasonic control algorithm, stable ultrasonic output frequency and fast response speed; FPGA parallel Control algorithm design, fast bonding speed; high-precision voice coil motor force control technology and force compensation algorithm design, precise bonding pressure control, high bonding accuracy; integrated design of the whole machine, compact structure, good user experience.
Main parameters
Wire diameter
Gold wire: 15 μm - 100 μm
Platinum wire: 18 μm - 100 μm
Aluminium wire: 18 μm - 100 μm
Copper wire : 18 μm - 25 μm
Gold Ribbon: 50 μm ×12.5 μm - 300 μm × 25.4 μm
Chopper Type
Φ1/16 1 6 mm ball welding chopper
Φ1/16, Φ3/32 19mm, 25mm wedge welding chopper
Maximum cavity depth
16mm
Welding pressure
1-250g, 1g subdivision step; program control, interface adjustable
Brake method
Electric, no compressed air required
Pressure welding head vertical stroke
20mm
Pressure welding head horizontal stroke
15mm×15mm (operating handle ratio 8:1)
Wire clamp feeding stroke
800 μm
Feeding method
90° (deep cavity) or 45°
Liftable workbench
Liftable height: 20 mm
Area: 270mm× 2 65mm
Ultrasound
0-10 W, maximum accuracy 0 .4 mW
wire feeder
1/2" or 2" spool
Interactive interface
7" TFT LCD touch screen, menu can be switched between Chinese and English
Fixture
2", 3", 4" slotted/unslotted hot or cold bench

Equipment application fields

M6000 multifunctional wire bonder is widely used in microwave devices, hybrid circuits, RF devices/modules, discrete devices, sensors, COB modules, MCM, MEMS devices, optoelectronic devices, etc.

Standard configuration

Name
model
Device host
MDHX-M6000 (Ball and wedge welding bonder)
thermostat
220VAC 50/60Hz
Clamping table
3″ non-slotted countertop with clips, 200°C
microscope
15X magnification
spool
1/2″
wire clip
90°
Liftable workbench
Stroke: 20mm
LED Ring Light
6W, stepless adjustment of brightness
Peripheral parameters
name
model
Input voltage
220VAC±10%
power
500W _
frequency
50Hz - 60Hz
Dimensions
603mm (L)X596mm ( W) X319mm (H)
Total Weight
46 kg
Packing & Delivery
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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