Wafer size
|
4”~ 8” wafer
|
Wafer thickness
|
100~750 microns
|
Wafer type
|
Si, SiC, GaN, or other materials
|
Film type
|
Blue film, UV film
Width: 230 ~ 300 mm Length: 100 m Thickness: 0.05 ~ 0.2 mm |
Wafer carrier ring
|
6”、8”DISCO
|
Loading and unloading method
|
Manual wafer/carrier ring placement and removal
|
Film positioning accuracy
|
±0.5mm
Standard 6” and 8” wafer plates for 6” and 8” wafers |
Vacuum pump
|
Minder-Hightech
|
Antistatic control
|
Deionization fan
|
Control unit
|
Based on PLC control, with 10” touch screen
|
Safety protection
|
Configured with light curtain protection and emergency stop button
|
Power supply voltage
|
Single-phase AC 220V, 16A
|
Compressed air
|
0.45~0.6MPa, flow rate 70L/min
|
Machine housing
|
White plastic-sprayed metal housing
|
Volume
|
850mm (width)*1750mm (depth)*1970mm (height)
|
Net weight
|
480kg
|
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