Aligner /Alignment Machine photolithography , China Aligner /Alignment Machine photolithography Manufacturers, Suppliers, Factory

Products Description

Mask Aligner Lithography Machine

Mask Aligner is mainly used in the development and production of small and medium scale integrated circuits, semiconductor components, optoelectronic devices, surface acoustic wave devices, thin film circuits and power electronic devices
Mask Aligner Also known as: mask alignment exposure machine, exposure system, lithography system, etc., is the core equipment for manufacturing chips. It uses the technology similar to photo printing to print the fine patterns on the mask onto the silicon wafer by light exposure
Mainly composed of: high-precision alignment workbench, binocular separated field of view vertical microscope, binocular separated field of view horizontal microscope, digital camera, computer imaging memory system, multi-point light source (fly eye) exposure head, PLC control System, pneumatic system, vacuum system, direct-connected vacuum pump, secondary anti-vibration workbench and accessory box

Aligner /Alignment Machine photolithography manufacture

Aligner /Alignment Machine photolithography factory

Characteristic

1. High uniformity fly-eye exposure head / air flotation leveling mechanism / reliable vacuum clamping exposure. high resolution.
2. Aligning method by mask keep stable and substrate feeding, which make sure the consistency of the guide gravity and the force.
3. Using gapless straight guide, high precision, fast speed.
4. All model suitable to work with all standard photoresists. such as AZ, Shipley, SU 8.
5. All model The pattern quality transferred by the system to the substrate 5 mask applications should be the same as the pattern quality after the application of the first mask.
6. Exposure time adjustable between 1 second and 1 hour. Alignment accuracy 1 µm

Aligner /Alignment Machine photolithography supplier

Aligner /Alignment Machine photolithography details

Specification

Model	MD-G25A	MD-G25D	MD-G31		MD-G33
Exposure type	One side			Double side alignment and double side exposure
Exposure mode	Contact hard, soft and non-contact proximity
Exposure head quantity	1 Exposure head			2 Exposure head
Type of light source	GCQ350 spherical mercury lamp						LED UV exposure head
Cooling method	Air cooling
Exposure area	Φ100mm	110×110mm	Φ100mm		150mm×150mm
Exposure mode	Compatible with contact hard, soft
Exposure unevenness	Φ100mm<±3%<>	≤±3%
Exposure resolution	2μm	1 μm
Beam intensity(365 nm)	≥6mw/ cm²	≤40mw/cm2	≥5mw/cm2		0～30mw/cm2
Beam inhomogeneity	≤±4%	≤±3%
UV light maximum deviation angle	4°	3°
Lighting range	≤Φ117mm	Φ117mm	≤Φ117mm		Front and back ≥ Φ115mm
Wedge error compensation mode	Hemispherical automatic compensation			Auto elimination		3 point automatic compensation
The travel of the X and Y axes	±4mm	±5mm	±4mm		±5 mm
The travel of the θ	±3°	≤5°	≤±5º		≤0.5°
XYZ substrate displacement resolution	0.5µm	0.3µm	0.3µm		0.01µm
Microscope system	Two single barrel microscopes /Two CCD cameras
Display size	15 inches
Imaging system resolution	2µm	1.5µm	1.5µm		1.5µm
Mask and the substrate measurement distance	0.5 µm	0.3 µm
Diagonal dimension of CCD target surface	1/3,（6mm）						40mm～110mm
Setting table size	≤ Square 5*5 inch(Customizable specifications)
Substrates size	Φ 100mm or 100*100mm square	60*49.5mm square	2”-4”		1"x1"-5"x5"
Substrate thickness	1-3mm	≤5 mm	1-3mm		≤5 mm
Vacuum pump	Oil free mute（-0.07～－0.08MPα）
Clean compressed air	≥0.4MPα
Power Supply	AC 220V±10% 50HZ 1.5KW
Clean room grade	Class 100
Clean room temperature	25℃±2℃
Relative humidity of clean room	≤60%
Vibration amplitude of clean room	≤4μm
Equipment size	1300 ×720×1600mm				1500 ×800×1600mm
Equipment weight	200kg				280kg

Manufacturing high-precision alignment system needs to have nearly perfect precision mechanical process. Another technical problem of alignment system is alignment microscope. In order to enhance the field of view of microscope, many high-end lithography machines use LED lighting. There are two sets of alignment system with focusing function. It is mainly composed of two eyes and two fields of view aiming at the main body of the microscope, one pair of eyepiece and one pair of objective lens (lithography machine usually provides eyepiece and objective lens with different magnification for users). The function of CCD alignment system is to enlarge the alignment marks of mask and sample and image them on the monitor.

The work piece stage is a key part of the lithography machine, which is composed of the mask sample overall motion stage (XY), the mask sample relative motion stage (XY), the rotation stage, the sample leveling mechanism, the sample focusing mechanism, the wafer stage, the mask clamp and the pull-out mask stage. The sample leveling mechanism comprises a ball seat and a hemisphere. In the leveling process, firstly, pressure air is applied to the ball seat and hemisphere, and then the ball seat, hemisphere and sample piece move upward through the focusing hand wheel, so that the sample piece can be leveled against the mask, and then the two position three-way solenoid valve switches the ball seat and hemisphere to vacuum for locking to maintain the leveling state.

Minder-Hightech brings you an advanced technology for photolithography through Aligner/Alignment Machine.

Are you struggling with not enough accuracy while printing circuits on your electronic products? With Minder-Hightech's Aligner/Alignment Machine, you can rest knowing that you will achieve high-level precision on your printed circuits production.

With this revolutionary item, you can seamlessly transfer a high-resolution image onto a product using photolithography. This machine guarantees accuracy through an operational system of aligning the material to the image.

After the pictures were printed and uploaded, the machine calculates the amount of exposure required and how the material is aligned with mention of the pictures. This calculation is done by using the latest computer software that can be updated to meet up with the technological development in the production industry.

It will allow you to make a wide range, including microcircuits, radiofrequency (RF) circuits, and built-in circuits. The unit can produce the best etch depth, track width, and layer-to-layer alignment through the addition of various complementary procedures, such as chemical etching and electroplating.

Our product’s advantage lies in its capability to produce high alignment, which guarantees that patterns are situated with great precision on the material. You can conveniently print many complicated designs without any deformities.

It is user-friendly, compact, and efficient, making it suitable for various manufacturing facilities or company's size. Additionally, our device comes with a manual upkeep and on-site training with our team of tech support staff.

Minder-Hightech’s Aligner/Alignment Machine uses photolithography technology to help you achieve the best results while printing your circuits. Experience a new level of technology that offers you high accuracy and precision that cannot be matched by traditional printing methods. Minder-Hightech’s Aligner/Alignment Machine is what your manufacturing company needs to stay a step ahead of the competition. Get in touch with us today to enjoy the benefits of the best Aligner/Alignment Machine technology in the market.