Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean
  • Automatic CMP Post Clean

Automatic CMP Post Clean

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Product Description

Cleaning Equipment after Wafer Chemical Mechanical Polishing

CMP Post Chean

Machine features

Strong process capability
Dual chamber brushing, with a wide range of process applicability
The equipment occupies a small area, with dimensions of 2200 * 800 * 2200 (mm)

Application Fields

6-8 inch CMP after brushing
Cleaning after grinding SIC or other substrates

Technical parameters

Cleaning after 4-inch and 6-inch CMP
Dual chamber design, independent chamber operation Wet in and dry out or dry in and dry out
High speed spin dry SRD

LoadPort unit, loading unit

LoadPort is the loading unit of this device
Wet Cassette feeding
Has spray moisturizing function

Brush unit, Wafer cleaning unit

Dual chamber unit, capable of supporting two different cleaning solutions
The brushing position can be adjusted according to the recipeBelt Conveyor

SRD unit, Wafer drying unit

Wafer clamp type spin drying, with a maximum speed of 4000RPM
Can perform AS cleaning on wafer surface and spray DIW

UNLOAD unit, cutting unit

The UnLoad unit has an independent FFU to ensure the cleanliness of wafer output

Conveyor

Wet area is belt conveyor
Dry area for Robot teleportation

Brush unit description

As shown in the left figure, the brush unit of this device consists of two brushing units, namely BU1 BU2.
The brush pressure of each unit can be adjusted separately (as specified in the recipe), and each brush blade unit can be washed with different chemical cleaning solutions separately.
The brush of the machine adopts PVA brush, which is a commonly used type in the market.
The transmission between cavities is belt conveyor. There is a DIW RINSE inside the cavity

SRD unit

The SRD unit is equipped with a clamping CHUCK and an AS ARM, which can further physically clean and spin dry the wafer surface.
Specification
Equipment size:
2200 * 800 * 2200 (mm)
Loading and unloading methods
dry in/wet in/dry out
Number of brushing units
2
Number of SRD units
1
Transport method
Wet zone belt transport, dry zone robot transport
The size of the equipment with a brushing chamber of 1 is 1850 * 800 * 2200
Packing & Delivery
Company Profile
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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