Automatic Die Bonder die attach for LED Packaging assemble

Application

Suitable for: SMD HIGH-POWER COB, part COM in-line package etc.

1, Full automatic up load and down load materials.
2, Module design, max optimization structure.
3, Full intellectual property right.
4, Picking die and Bonding die dual PR system.
5, Multi-wafer ring, dual glue ect configuration.

Specification

Bonding workstage
Load ability	1 piece
XY stroke	10inch*6inch(working range 6inch*2inch)
Accuracy	0.2mil/5um
Dual work stage can feed continuously

Wafer workstage
XY travel stroke	6inch*6inch
Accuracy	0.2mil/5um
Wafer position accuracy	+-1.5mil
Angle accuracy	+-3 degree

Die dimension	5mil*5mil-100mil*100mil
Wafer dimension	6inch
Picking up range	4.5inch
Bonding force	25g-35g
Multi wafer ring design	4 wafer ring
Die type	R/G/B 3type
Bonding arm	90degree rotary
Motor	AC servomotor

Image recognition system
Method	256 gray scale
Check	ink dot, chipping die, crack die
Display screen	17inch LCD 1024*768
Accuracy	1.56um-8.93um
Optics magnification	0.7X-4.5X

Bonding cycle	120ms
Number of program	100
Max die number on one substrate	1024
Die lost check method	vacuum sensor test
Bonding cycle	180ms
Glue dispensing	1025-0.45mm
Die lost check method	vacuum sensor test

Input voltage	220V
Air source	min. 6BAR, 70L/min
Vacuum source	600mmHG
Power	1.8kw
Dimension	1310*1265*1777mm
Weight	680kg

Detail

Our Factory

Packing & Delivery

FAQ

Q: How to buy your products?
A: We have some products in stock, you can take away the products after you arrange the payment;
If we don’t have the products in stock you want, we will start production once getting the payment.
Q: What’s the warranty for the products?
A: The free warranty is one year from the date of commissioning qualified.
Q: Can we visit your factory?
A: Of course, welcome to visit our factory if you come to China.
Q: How long is the validity of quotation?
A: Generally, our price is valid within one month from the date of quotation. The price will be adjusted appropriately as the price fluctuation of raw material in the market.
Q: What’s the production date after we confirm the order?

A: This depends on the quantity. Normally, for the mass production, we need about one week to finish the production.

Minder-Hightech

Introducing the Automatic Die Bonder, the ultimate solution for high-quality and efficient die attaching in LED packaging assembly. Our product is designed to provide precision and consistency in every application, ensuring uniformity and reliability in your LED device production. 

With our Automatic Die Bonder, you'll now streamline your manufacturing process and achieve improvements significant efficiency and yield. Our Minder-Hightech

 device provides accurate and quick die placement, with a throughput of up to 10, 000 UPH or devices per hour, rendering it an ideal choice for high-volume packaging installation is LED. 

Built with advanced features designed to optimize your die attaching process. We have vision is high-resolution that assures precise alignment of the die, guaranteeing accurate and consistent placement each time. Our system additionally provides feedback is real-time allowing you to monitor the entire die attaching process and adjust the machine as needed. 

versatile and can accommodate a range is wide of package types and sizes. We can customize the machine to suit the needs of your LED packaging construction process, ensuring that you will get the performance is best and maximum efficiency for your manufacturing line. 

Easy task to make use of, by having an interface is user-friendly simplifies operation and eliminates the need for extensive training. Our machine is created with operator safety in mind, with features that prevent accidents and minimize risks during operation. 

We simply take pride in the quality of our products and provide excellent after-sales support to ensure your satisfaction is complete with Automatic Die Bonder. Our team of experts is always available to work with you with any questions or concerns, providing prompt and support is reliable you need it. 

Invest in the Minder-Hightech Automatic Die Bonder today and experience the benefits of advanced technology in your LED packaging assembly process.