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  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380
  • Automatic die bonder manual upload and down load  MD-JC360 MD-JC380

Automatic die bonder manual upload and down load MD-JC360 MD-JC380

Presenting the Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380 from Minder-Hightech, the provider leading of quality and revolutionary solutions for semiconductor packaging and assessment.  

Designed to meet with the needs of today's high-tech companies, advanced die machine will be the perfect choice for different applications including LED packaging, energy products, sensors, RFID tags and a lot more. It offers precision accuracy unparalleled dependability, rendering it a significant device for the manufacturing line. 

Using the Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380, you will achieve constant and bonding uniform of and substrate, many thanks to its high-speed and exact motorized XYZ stage. The equipment has been the capacity of doing as much as 4,500 CPH (rounds each hour) and therefore can bond dies no more than 50 cm, by having a bonding accuracy of ±1 cm. The customer intuitive is built to simplify the process and development regarding the device, permitting easy and setup quick changeover. The screen features a touchscreen display and a computer user-friendly software enables uploading and having of programs, as well as information analysis and storage space.  

The Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380 comes with a high-capacity load slot which could accommodate up to 36 or 48 wafers, with regards to the model. The device has an automatic positioning which allows precise positioning regarding the dies, making sure the bonding procedure is optimized and yield is maximized. Furthermore, these devices are produced with security in your mind, with numerous security interlocks and a pressure ensures sensor the bonding procedure is halted if any anomalies are detected.  

At Minder-Hightech, we you need to take pride within our dedication to quality, so we give attention to supplying all the degree to our greatest clients of quality in many our products and services. Along with the Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380, maybe you are guaranteed associated with the dependable item, durable and effective, delivering performance superior efficiency to your manufacturing line. 


Product Description

Automatic die bonder manual upload and down load

MD-JC360: 8inch wafer die bonder manual upload and download.

Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k;

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 supplier

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 supplier

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 manufacture

Specification
MD-JC360: 8inch wafer die bonder manual upload and download.
Solid Crystal Worktable (Linear Module) 

Worktable stroke:
450x220mm

Resolution:
1μm

Optics Magnifier:
0.7 times to 4.5 times

Cycle Time:
200MS/EA

Loading and unloading module:
Manual loading and unloading

Die Workbench (Linear Module) 

XY stroke:
8"*8"

Resolution:
1μm

Wafer placement accuracy

Adhesive die position x-y :
±2mil

Rotation accuracy:
±3°

Dispensing module:
Swing arm dispensing + heating system

Dispensing needle set can be exchanged by single or multiple needles

PR System

Method :
256 grey levels

Detection:
ink墨点/chipping破晶/cracked die裂晶

Monitor:
17" LCD

Monitor Resolution:
1024*768

Equipment Require :

Voltage:
AC220V/50HZ

Air Source:
minimum最少6BAR

Vacuum Source:
700mmHG(Vacuum pump)

Power Consumpion 功率:
3000w

Missing Die:
Vacuum Sensor 真空传感器检测

Dimensions And Weight:

Weight:
450kg

Size(DxWxH):
1200*900*1500mm

MD-JC380:12inch wafer die bonder manual upload and download 





Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 supplier

Detail

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 manufacture

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 supplier

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 factory

Our Factory

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 details

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 details

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 manufacture

Packing & Delivery

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 factory

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 manufacture

If you want to konw more,please contact our sales engineer:

Automatic die bonder manual upload and down load  MD-JC360 MD-JC380 details

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