Presenting the Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380 from Minder-Hightech, the provider leading of quality and revolutionary solutions for semiconductor packaging and assessment.
Designed to meet with the needs of today's high-tech companies, advanced die machine will be the perfect choice for different applications including LED packaging, energy products, sensors, RFID tags and a lot more. It offers precision accuracy unparalleled dependability, rendering it a significant device for the manufacturing line.
Using the Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380, you will achieve constant and bonding uniform of and substrate, many thanks to its high-speed and exact motorized XYZ stage. The equipment has been the capacity of doing as much as 4,500 CPH (rounds each hour) and therefore can bond dies no more than 50 cm, by having a bonding accuracy of ±1 cm. The customer intuitive is built to simplify the process and development regarding the device, permitting easy and setup quick changeover. The screen features a touchscreen display and a computer user-friendly software enables uploading and having of programs, as well as information analysis and storage space.
The Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380 comes with a high-capacity load slot which could accommodate up to 36 or 48 wafers, with regards to the model. The device has an automatic positioning which allows precise positioning regarding the dies, making sure the bonding procedure is optimized and yield is maximized. Furthermore, these devices are produced with security in your mind, with numerous security interlocks and a pressure ensures sensor the bonding procedure is halted if any anomalies are detected.
At Minder-Hightech, we you need to take pride within our dedication to quality, so we give attention to supplying all the degree to our greatest clients of quality in many our products and services. Along with the Automatic Die Bonder Manual Upload and Download MD-JC360 and MD-JC380, maybe you are guaranteed associated with the dependable item, durable and effective, delivering performance superior efficiency to your manufacturing line.
MD-JC360: 8inch wafer die bonder manual upload and download.
Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k;Solid Crystal Worktable (Linear Module) | ||
Worktable stroke: | 450x220mm | |
Resolution: | 1μm | |
Optics Magnifier: | 0.7 times to 4.5 times | |
Cycle Time: | 200MS/EA | |
Loading and unloading module: | Manual loading and unloading | |
Die Workbench (Linear Module) | ||
XY stroke: | 8"*8" | |
Resolution: | 1μm | |
Wafer placement accuracy | ||
Adhesive die position x-y : | ±2mil | |
Rotation accuracy: | ±3° | |
Dispensing module: | Swing arm dispensing + heating system | |
Dispensing needle set can be exchanged by single or multiple needles | ||
PR System | ||
Method : | 256 grey levels | |
Detection: | ink墨点/chipping破晶/cracked die裂晶 | |
Monitor: | 17" LCD | |
Monitor Resolution: | 1024*768 | |
Equipment Require : | ||
Voltage: | AC220V/50HZ | |
Air Source: | minimum最少6BAR | |
Vacuum Source: | 700mmHG(Vacuum pump) | |
Power Consumpion 功率: | 3000w | |
Missing Die: | Vacuum Sensor 真空传感器检测 | |
Dimensions And Weight: | ||
Weight: | 450kg | |
Size(DxWxH): | 1200*900*1500mm |
MD-JC380:12inch wafer die bonder manual upload and download
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