Guangzhou Minder-Hightech Co.,Ltd.
EN
Guangzhou Minder-Hightech Co.,Ltd.
Get Quote

Guangzhou Minder-Hightech Co.,Ltd.

Home
About Us
MH Equipment
Solution
Oversea Users
Video
Contact Us
Home> Wafer Grinder
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP
  • Automatic Single Platen Wafer Chemical Mechanical Polisher CMP

Automatic Single Platen Wafer Chemical Mechanical Polisher CMP

Get a Free Quote
Product Description
ATOM Single Platen CMP

Machine features

The device is flexible and can support multiple heads.
The equipment's process capability is close tothe mainstream model level of products of the same size.
Good consistency of inter device process.

Application Fields

4-8 inch STI, ILD/IMD, TSV, TGV polishing, and surface polishing of compounds such as SiC, LT, LN, GaAs, etc

Technical parameters

4-inch, 6-inch, 8-inch heads, multi zone control
Type Of Φ20 inch 508MM Platen
Head pressure control accuracy<0.05PSI
Head and Platen rotation speed control accuracy<2RPM

1. LoadPort Unit

Port can be flipped to immerse Cassette in Qtank, avoiding the formation of Slurry crystals on the
polished surface of Wafer. Equipped with Cassette Mapping function.

2. Robotmaterial retrieval unit

Equipped with a 4-axis robot, it can automatically transfer wafers from Cassette to the polishing unit.

3. Polisher Unit

This unit is equipped with Platen * 1, Head * 1, PC *
1, Slurry Arm * 1, HCLU * 1, and EPD endpoint
detection. It can achieve automatic wafer loading and unloading, multi zone head control, Slurry
landing point changing with Recipe settings, endpoint detection and other functions.
CMP Polisher Head
The Polisher Heads configured on this device are all independently developed, designed, and produced by our company.
Among them, the 4-inch 3-cavity Head is a unique product created by our company, filling the gap of no multi cavity 4-inch Head in China. Our company can quickly modify or customize the Head according to the characteristics of the customer's product. In the development of TGV thin film (200um) products, the internal structure of the Head was modified to meet the requirements of thin film polishing. During the development process of LN surface OX polishing technology, our company deeply upgraded the 6-inch Head and successfully met the customer's product requirements.
Applications
Traditional IC planarization polishing process；
TGV/TSV process；
Smart Cut and Pre bonding CMP；
SIC substrate polishing/gallium arsenide polishing.
Specification
Port
Quantity * 1, with Q-tank
Robot
Quantity * 1, for wafer transfer
HCLU
Quantity * 1, for automatic loading and unloading of wafers
Polishing head
Quantity * 13 cavity control, control accuracy of 0.1PSI, can support 400-1200 UM wafer operations.
Polishing head speed
5-150RPM
Polishing Disc
Quantity * 1 Polishing Disc Size 508mm, Polishing Pad Speed 10-150rpm.
Trimming arm
Quantity * 1 polishing pad. The polishing pad can be polished online (simultaneously) or offline (after polishing). The trimming
arm is equipped with a trimming shaft, which can rotate and move up and down, andthe speed and downforce can be controlled. The
trimming tool is installed on the trimming shaft and can be quickly
removed. According to the different types of polishing pads, different types of dressing tools are configured, including dressing
brushes, diamond rings, and diamond discs.
UPA polishing head air pressure control unit
Quantity * 13Zone adjustable for better surface planarization effect
Polishing liquid supply pump
Quantity * 2. Peristaltic pumps are used for liquid supply, with 2 peristaltic pumps configured to deliver different polishing
liquids to the polishing disc. Each pump can be used in any step of the process.
Slurry Arm
Quantity * 1 can control the landing point of the slurry and can clean the polishing pad.
The operation control system can achieve user level control, such as operator mode, maintenance mode, and technical mode, and var
ious modes are controlled by passwords. The system software can edit the process parameters of each process step and flatten and
polish the thin film on the chip surface according to the program. It can monitor the operation status of equipment, monitor
process parameters in realtime, andthe software can automatically store various process data. Equipped with an emergency stop
button, used to immediately stop equipment operation and cut off control power.
Packing & Delivery
Company Profile
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

More Products

Inquiry

Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved

Privacy Policy

Inquiry Email WhatsApp WeChat
Top
×

Get in touch