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  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine
  • Automatic wire ball bonder MD-S800 wire bonder wire bonding machine

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine

Minder-Hightech


The Automatic wire ball bonder MD-S800 wire bonder wire bonding machine is merely an item top-notch, a professional and brand dependable you can purchase of cable bonder devices. This revolutionary product was built to meet the requirements of assorted companies, including devices are electronic telecommunications, and automotive. 


Fashioned with advanced level technology, the Minder-Hightech Automatic cable ball bonder MD-S800 model is easy to work with and efficient. It permits a person to relationship cables quickly and accurately, as a total result of their procedure high-speed and motions. The apparatus comes with a very good 5x lens objective a high-resolution camera, allowing the operator take notice of the bonding procedure with simplicity. 


The MD-S800 model features a versatile and program user-friendly which makes it suitable for both novices and experienced users. It comes with a touch-screen display displays real-time information, including cable size, rate, and force bonding. The application is sold with various programs could be effortlessly modified to fit bonding 's. 


The Automatic wire ball bonder MD-S800 wire bonder wire bonding machine model delivers a space-saving solution without compromising on performance featuring its compact design. The product features an impact Bit and can fit effortlessly in tiny workspaces, and will be effortlessly transported to places are various needed. 


This cable bonding device is made to control a range of cable diameters and materials, including silver, aluminum, and copper. In addition, has enhanced functions such as ultrasonic cleansing and track real-time of cable stress, making this product last of great quality and integrity. 


The Automatic cable ball bonder MD-S800 model includes an assurance comprehensive protecting the customer against any defects in materials or workmanship. It is sold with exemplary customer support and help technical making the consumer features a trouble-free experience through the lifespan when it comes to item. 

Product Description

Automatic wire ball bonder   MD-S800

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine factory

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine details

Specification
1.  Technical Specification
X-Y stage stroke

X-Y stroke:
65*70 mm

X-Y stage accuracy:
0.04 mil(1um) 

Z bonder stroke:
9.0 mm

Image recognition system and optical system

Image recognition method:
256 grey scale, can recognize R/G/B and matte chips

Resolution:
640*480

Optical magnification:
2~4, adjustable

Optical magnification:
±0.37 um

Ultrasonic generator and transducer

Ultrasonic generator
UTHE 10H-P2

Ultrasonic transducer:
UTHE 70PT

Temperature controller:
OMRON E5CSL

User interface:
Windows xp system, Chinese and English language

Program memory size:
1000

Min golden wire:
0.5 mil

Velocity

Bonding cycle:
70ms/2mm wire

Unit per hour:
28K (single wire), 15K (dual wire) 

Working condition

Voltage/Frequency:
AC220V/50-60Hz

Compressed air:
≥0.3~0.5 Bar

Rated power:
1200 W

Gas consumption:
80 LMP

Weight and size

Weight:
800 kg

Size:
1230mm*940*1660

Detail

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine supplier

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine manufacture

Sample

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine details

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine manufacture

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine details

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine factory

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine details

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine supplier

Customer useing
We have 16 years of experience in equipment sales ,and can provide you with a one-stop IC Package Line
please contact our sales engineer:

Automatic wire ball bonder MD-S800 wire bonder wire bonding machine factory

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