Minder-Hightech
The Automatic wire ball bonder MD-S800 wire bonder wire bonding machine is merely an item top-notch, a professional and brand dependable you can purchase of cable bonder devices. This revolutionary product was built to meet the requirements of assorted companies, including devices are electronic telecommunications, and automotive.
Fashioned with advanced level technology, the Minder-Hightech Automatic cable ball bonder MD-S800 model is easy to work with and efficient. It permits a person to relationship cables quickly and accurately, as a total result of their procedure high-speed and motions. The apparatus comes with a very good 5x lens objective a high-resolution camera, allowing the operator take notice of the bonding procedure with simplicity.
The MD-S800 model features a versatile and program user-friendly which makes it suitable for both novices and experienced users. It comes with a touch-screen display displays real-time information, including cable size, rate, and force bonding. The application is sold with various programs could be effortlessly modified to fit bonding 's.
The Automatic wire ball bonder MD-S800 wire bonder wire bonding machine model delivers a space-saving solution without compromising on performance featuring its compact design. The product features an impact Bit and can fit effortlessly in tiny workspaces, and will be effortlessly transported to places are various needed.
This cable bonding device is made to control a range of cable diameters and materials, including silver, aluminum, and copper. In addition, has enhanced functions such as ultrasonic cleansing and track real-time of cable stress, making this product last of great quality and integrity.
The Automatic cable ball bonder MD-S800 model includes an assurance comprehensive protecting the customer against any defects in materials or workmanship. It is sold with exemplary customer support and help technical making the consumer features a trouble-free experience through the lifespan when it comes to item.
X-Y stage stroke | ||
X-Y stroke: | 65*70 mm | |
X-Y stage accuracy: | 0.04 mil(1um) | |
Z bonder stroke: | 9.0 mm | |
Image recognition system and optical system | ||
Image recognition method: | 256 grey scale, can recognize R/G/B and matte chips | |
Resolution: | 640*480 | |
Optical magnification: | 2~4, adjustable | |
Optical magnification: | ±0.37 um | |
Ultrasonic generator and transducer | ||
Ultrasonic generator | UTHE 10H-P2 | |
Ultrasonic transducer: | UTHE 70PT | |
Temperature controller: | OMRON E5CSL | |
User interface: | Windows xp system, Chinese and English language | |
Program memory size: | 1000 | |
Min golden wire: | 0.5 mil | |
Velocity | ||
Bonding cycle: | 70ms/2mm wire | |
Unit per hour: | 28K (single wire), 15K (dual wire) | |
Working condition | ||
Voltage/Frequency: | AC220V/50-60Hz | |
Compressed air: | ≥0.3~0.5 Bar | |
Rated power: | 1200 W | |
Gas consumption: | 80 LMP | |
Weight and size | ||
Weight: | 800 kg | |
Size: | 1230mm*940*1660 |
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