Guangzhou Minder-Hightech Co.,Ltd.

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  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder
  • Customized High precision High speed Die bonder

Customized High precision High speed Die bonder

Product Description

High Precision Semiconductor Chip Die bonding machine

This model is a chip placement machine designed specifically for high-precision optical modules, optical components, sensors, and various high-precision IC packaging flip chips.
Customized High precision High speed Die bonder supplier
Customized High precision High speed Die bonder supplier

High speed solidification machine, composed of multiple subunit modules:

1、 Direct drive rotating solid crystal bonding head, 180 ° swing arm rotation with linear bonding head
2、 Multi pin design for easy adaptation to different types and sizes of wafer chips
3、 1.3 million resolution visual system for positioning chips and frames
4、 Servo controlled precision dispensing system, capable of drawing glue
5、 Automatic magazine feeding and receiving
6、 Solid crystal worktable module, using linear motor and high-precision grating ruler
7、 Crystal rings are suitable for 12 inch, 8-inch, and 6-inch iron ring wafers
Product Structure
Customized High precision High speed Die bonder supplier

Equipment dispensing

Glue dispensing and drawing interface: simple and convenient operation, multiple commonly used glue drawing methods
Customized High precision High speed Die bonder supplier
Equipment glue effect:
Customized High precision High speed Die bonder details
Multiple visual algorithm applications
Customized High precision High speed Die bonder factory
Packing & Delivery
Customized High precision High speed Die bonder supplier
Customized High precision High speed Die bonder details
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
Customized High precision High speed Die bonder supplier
Customized High precision High speed Die bonder supplier
Customized High precision High speed Die bonder factory
Customized High precision High speed Die bonder factory
Customized High precision High speed Die bonder supplier
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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