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  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

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Product Description

MDAX-898ZD Customized high precision semiconductor die bonding machine

This model is a solid-state SMT machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chipsMDAX-898ZD high-speed solidification machine, composed of multiple subunit modules: 1、 Direct drive solid crystal bonding head with rotating suction nozzle 2、 Multi pin design for easy adaptation to different types and sizes of wafer chips 3、 1.3 million resolution visual system for positioning chips and frames 4、 Servo linkage direct connection high-precision adhesive system, capable of drawing adhesive 5、 Manual loading and unloading vehicles 6、 Solid crystal workbench module, using linear motor and high-precision grating ruler 7、 Crystal ring can be used for 8-inch and 6-inch crystal wafers (automatic ring expansion function)
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Function
High speed: According to customer process requirements, achieve the fastest speed in the industry SMT accuracy: According to customer process requirements, achieve the highest accuracy in the industry (lithography board+chip) Surface mounting angle accuracy: ± 1.5 ° Pressure regulation: adjustable from 20g to 300g Linear structure bonding head Multiple image positioning schemes (appearance, feature points, edge finding, circle finding) First adhesive dot diameter control detection Connected mode device, multiple serial devices complete device packaging Capable of dispensing and drawing glue Automatic ring expansion function

Glue dispensing and drawing interface

Easy and convenient to operate, with multiple commonly used glue drawing methods
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Specification
Model
MDAX-898ZD
UPH
2K Pcs (Chip related) 
X、Y Surface mount position accuracy
+15-20um
Surface mounting angle accuracy
+1.5°
Surface mounting pressure range and accuracy
20~300g ±10%
Ring size and adaptability
8inch、6inch Wafer (with automatic ring expansion) 
Maximum camera accuracy
1um
Camera field of view
1.0mm~8mm
Number of suction nozzles
1PCS
Number of thimbles 
1PCs, Multi pin (optional) 
Vehicle size range
Width:40mm~90mm, Length:120mm~320mm
Console height
950mm±30mm
Power supply
AC 220V/50Hz
Power consumption
800w
Compressed gas
4~6 Bar
Net weight
800 Kg
Feature
1. Multiple image positioning schemes (appearance, feature points, edge finding, circle finding).
2. High speed: According to customer process requirements, achieve the fastest speed in the industry.
3. Surface mounting angle accuracy: + 1.5 ° ; linear structure bonding head ; Automatic ring expansion function
4. Pressure regulation: adjustable from 20g to 300g ; Control and testing of the diameter of the first adhesive point
5. Capable of dispensing and drawing glue ; Connected mode device, multiple serial devices complete device packaging.
6. SMT accuracy: According to customer process requirements, achieve the highest accuracy in the industry (lithography board+ chip)
Packing & Delivery
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory

Presenting the Minder-Hightech tailored high accuracy semiconductor pass away bonding machine pass away bonder IC package. 

This state-of-the-art tool is the perfect option for semiconductor companies looking to improve their manufacturing process while ensuring the highest degree of precision and integrity. 

You need to accomplish consistent outcomes every single time whether you're manufacturing complex incorporated circuits or simple diodes, this pass away bonding machine has everything. 

Featuring precision placement abilities, the Minder-High-tech pass away bonder can accurately place passes away into substrates with a diploma is high of and repeatability. 

This helps it be perfect for a number is wide of, from building and construction of microprocessors and memory chips to the product packaging of optoelectronic elements and RF items. 

Among the largest benefits of the Minder-High-tech pass away bonder is its power to handle a variety is wide of kinds and dimensions. 

Every one of them thank you to its advanced bonding technology whether you're functioning with small 3x3mm passes away or large 20x20mm packages, this machine can handle. 

In addition, the equipment is very personalized and will be customized specifically to healthy the expense that are individual requirements. 

Another feature is key of Minder-High-tech pass away bonding machine is its ease of use. 

This pass away bonder is designed with user-friendliness in mind unlike various other makers that can be hard to run and need comprehensive educating. 

User-friendly regulates and a display is simple it easy for also newbie drivers to quickly grasp the machine and accomplish professional-grade outcomes. 

If you're looking for a high-grade, reputable pass away bonding machine that can handle a large range of packages and deliver unbelievably precise outcomes, after that the Minder-High-tech tailored high accuracy semiconductor pass away bonding machine pass away bonder IC package is the perfect option. 


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