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  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

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Products Description
Dual head high speed Die Bonder
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
MDAX64DI-25-3 Planar Dual head high-speed Die Bonder
Applicable to SMD2020 1010 2121 2835 5730, filament, etc

Model characteristics

1. Independent double head die bonding, double stamp arm, double wafer search design, stable and reliable；
2. 90 degree direct connection high-precision servo Bonding head；
3. Adjustable constant temperature direct connection high-precision stamp head；
4. Linear motor wafer table and die bonding working table；
5. Vacuum die missing detection;
6. Automatic loading and unloading system is adopted to reduce refueling time；
7. Visual quality inspection system, such as glue quantity detection, anti dazzle detection, post die bonding detection, etc；
8. Simple visual operation interface simplifies the operation of automation equipment；
Specification
system function
production cycle：
≥40ms Speed depends on chip size and bracket size
Die placement accuracy：
±25um
Chip rotation：
±3°
Wafer stage
Chip size：
3.5mi1×3.5mi1-80milx80mil
Support specification：
L（L):120-200mm W（W):50-90mm
Chip maximum angle correction：
±180°(Optional）
Maximum chip ring size/Max. Die Ring Size：
6"
Maximum chip area size：
4.7"
Rerolution：
1μm
Height stroke of ejector：
3mm
Image recognition system
Gray scale：
256Grayscale
resolving power：
752×480pixel
Image recognition accuracy：
±0.025mil@50mil Observation range
Suction swinging arm system
Die bonding swing arm：
90 ° rotatable
Picking up pressure：
Adjustable 20g-250g
Die bonding work table
Travel range：
75mm*175mm
XY resolving resolution：
0.5μm
Leadframe support size
Support length：
120m~170mm(Customized if the length is less than 80~120mm of the support）
Support width：
40mm~75m(30~40mm lower than the width of the support, customized）
Required facilities
Voltage/frequency：
220V AC±5%/50HZ
compressed air：
0.5MPa (MIN)
Rated power：
950VA
Air consumption/Gas Consumption：
5L/min
Volume and weight
L x W x H：
135×90×175cm
weight：
1200kg
FAQ
Q: How to buy your products?
A: We have some products in stock , you can take away the products after you arrange the payment ;
If we don’t have the products in stock you want, we will start production once getting the payment.
Q: What’s the warranty for the products?
A: The free warranty is one year from the date of commissioning qualified.
Q: Can we visit your factory?
A: Of course, welcome to visit our factory if you come to China.
Q: How long is the validity of quotation?
A: Generally, our price is valid within one month from the date of quotation. The price will be adjusted appropriately as the price fluctuation of raw material in the market.
Q: What’s the production date after we confirm the order?
A: This depends on the quantity. Normally, for the mass production, we need about one week to finish the production.

Introducing the Minder-High-tech Dual Head High Speed Die Bonder Die Attach Machine - the ultimate solution for your semiconductor manufacturing needs.

 

Designed to facilitate a swift and assembly is efficient, our state-of-the-art die bonder machine has a range of innovative features that make it a game-changer in the industry.

 

Having a dual head setup, this enables you to bond two dies simultaneously, streamlining your production process while keeping accuracy and accuracy. The machine has a high-speed relationship head that ensures fast and dependable die positioning, ensuring your project is completed in a timely and manner is cost-effective.

 

Comes with a robust and reliable design is servo-driven a high-precision X-Y table. This feature enables a precise placement of dies onto circuit boards, ensuring uniform and dependable connections with pinpoint precision. Minder-High-Tec’s die bonder machine also supports a variety of substrates, including ceramics, silicon, and PCBs, making it an option is ideal a variety of applications.

 

Sold with a user-friendly software that enables for quick and programming is intuitive. The machine's intuitive design ensures users can quickly learn how to use, system, and take care of the machine, which decreases the risk of peoples mistake and increases the efficiency is overall of manufacturing process.

 

The total results of years of research and development, ensuring that it fulfills the needs of modern semiconductor production processes. It's manufactured with the product quality components which are highest, guaranteeing durable durability, and stability under the most challenging conditions.

 

The Minder-High-tech Dual Head High Speed Die Bonder Die Attach Machine is the ultimate investment for your semiconductor manufacturing processes. With this product, you can rest assured that you're investing in a product that will revolutionize your manufacturing processes.


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