Electronic and Semiconductor Equipment Laser Scribing System , China Electronic and Semiconductor Equipment Laser Scribing System Manufacturers, Suppliers, Factory

Product Description

Main features of the equipment:

1. Adopting a 355nm UV laser, which is a product with independent intellectual property rights and holds an American invention patent, it has stable performance, good spot mode, and can work stably for a long time.
2. Up and down CCD configuration, suitable for transparent and semi transparent wafer positioning.
3. The laser beam focuses on a fine spot, with a maximum of 4 μm and a depth of ≥ 25 μ
4. Reliable and high-precision X-Y - θ 5. Efficient and flexible software operating system, intuitive interface, and easy
operation.

Electronic and Semiconductor Equipment Laser Scribing System factory

Precision 3D platform:

1. Full closed-loop control, the repeated positioning accuracy of X and Y axes reaches ± 1 μm, and the positioning accuracy of θ axis is ± 15 ″.
2. X-axis and Y-axis scoring range: 200X200mm.
3. Excellent acceleration and deceleration performance, effectively improving the system's production capacity per unit time.

Electronic and Semiconductor Equipment Laser Scribing System supplier

Up and down CCD configuration

The workbench is equipped with one CCD system on both the top and bottom, which can locate the front and back MARK points of the wafer.

Electronic and Semiconductor Equipment Laser Scribing System manufacture

Laser characteristics:

1.Full closed-loop control ensures displacement error within ± 1 µ m throughout the entire travel range.
2.We use imported high-quality laser pump sources.
3.Advanced high conversion efficiency laser cavity optical design.
4.Provide stable high-power laser output at high frequencies.
5.Industrialized module design ensures long-term work stability. (Ensure time ≥ 10000 hours)

Operating software and functional characteristics

Semi-Automatic PET Bottle Blowing Machine Bottle Making Machine Bottle Moulding Machine PET Bottle Making Machine is suitable for producing PET plastic containers and bottles in all shapes.

Electronic and Semiconductor Equipment Laser Scribing System details

Scratching effect

The high-speed cutting seam width is guaranteed to be within 9 µm, providing the possibility of increasing chip production
capacity, providing almost vertical laser cutting effect, and maximizing the guarantee of chip shape after cracking.

Smoke and dust filtration system (optional)

Specification

Packing & Delivery

Company Profile

We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.