Grindable wafer |
Size |
Inches |
4,5,6,8 |
Wafer cassette |
Number |
- |
2 |
Rubbing way |
- |
Vertical plunge grinding method |
|
Grinding wheel spindle |
Types |
- |
Air bearings |
Quantity |
- |
2 |
|
Speed |
rpm |
0~5000 |
|
Output Power |
Kw |
5.5/7.5 |
|
Stroke |
mm |
150 |
|
Feed Speed |
um/s |
0.01~100 |
|
Fast forward speed |
mm/min |
300 |
|
Resolution |
um |
0.1 |
|
Workpiece axis |
Type |
- |
Ball bearings |
Quantity |
- |
3 |
|
Suction cup type |
- |
Microporous ceramics |
|
Wafer suction method |
- |
Vacuum adsorption |
|
Speed |
rpm |
0~300 |
|
Wafer transfer |
- |
Robot arm |
|
- |
Revolving disk |
||
Other functions |
Wafer centering |
- |
Mobile pin alignment |
Wafer cleaning |
- |
Water and air cleaning,spin drying |
|
Suction cup cleaning |
- |
Oilstone cleaning |
|
Grinding wheel |
mm |
Φ200 |
|
Online measurement |
Measurement range |
um |
0~1800 |
Resolution |
um |
0.1 |
|
Repeat accuracy |
um |
±0.5 |
|
Machining accuracy |
Intra-wafer accuracy (TTV) |
um |
≤2 |
Inter-wafer accuracy (WTW) |
um |
±3 |
|
Surface roughness (Ry) |
um |
0.13(2000#finish) |
|
Appearance |
Appearance coloring |
um |
Orange Pattern |
Dimensions(W×D×H) |
mm |
1200×2750×1950 |
|
Weight |
kg |
4200 |
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