IC Package line semiconductor equipment Multiple Die Attach Equipment

Minder-Hightech

IC Package line semiconductor equipment is an innovative and flexible solution to meet the demands of the semiconductor industry. It is designed to provides high-quality and reliable multiple dice attach equipment that can efficiently handles a variety of semiconductor components. 

A fully automated solutions that assures fast and handling is accurate of dies. The Minder-Hightech apparatus offers high-speed and positioning is high-precision of to 12 dies per second, which makes it perfect for high-volume production. 

Comes by having a state-of-the-art vision system that ensures accurate keeping of dies with all the accuracy is greatest. The vision system includes high-resolution cameras that offer real-time tabs on the die placement procedure. 

Highly flexible and may manage die is various and thicknesses. It's compatible with various types of packaging, including CSP, BGA, QFN, others. The gear can manage up to 20mm x 20mm die sizes and thicknesses ranging from 100um to 1.2mm. 

Not hard to utilize and needs training is minimal. It comes with a software is user-friendly allows operators to setup and operate the apparatus with ease. The equipment can be integrated with other semiconductor gear to form a production line is fully automated. 

Designed for high durability and reliability. It is created of high-quality materials and components that guarantee lasting operation. The equipment is equipped with advanced safety features that prevent damage to dies and the equipment itself. 

Leading the semiconductor industry, known for its high-quality and innovative solutions. The IC Package line semiconductor gear is no exception, providing a reliable and solution is efficient multiple die positioning. 

The Minder-Hightech Multiple Die Attach Equipment is an excellent choice for semiconductor manufacturers looking for a reliable and efficient solutions to handle multiple dies. The equipment is easy to use, flexible, and highly reliable, making it an ideal choice for high-volume productions. with its advanced features and state-of-the-art technology, Minder-High-Tec’s IC Package line semiconductor equipment is an investments refit semiconductor manufacturer for years to come.