ICP dry Plasma Removal of Photoresist / Plasma Photoresist removal (PR) machine for semiconductor wafer , China ICP dry Plasma Removal of Photoresist / Plasma Photoresist removal (PR) machine for semiconductor wafer Manufacturers, Suppliers, Factory

Product Description

ICP PLASMA Remove Photoresist Machine

ASHING
Polymer removal
Dry removal of hard mask layer
Photoresistance removal after ion implantation
Photoresistance removal in BAW/SAW process
Dry cleaning of anti reflective graphic film layer
Surface residue removal
Surface cleaning after etching
DESCUM

ICP dry plasma photoresist removal machine is suitable for DESCUM (pre-treatment, removal of photoresist residue) Polymer removal (PI, BCB, PBO) After ion implantation, photoresist removal, etc., the cavity is suitable for 8-inch samples (4-6 inch compatible)

ICP dry Plasma Removal of Photoresist / Plasma Photoresist removal (PR) machine for semiconductor wafer details

ICP dry Plasma Removal of Photoresist / Plasma Photoresist removal (PR) machine for semiconductor wafer supplier

ICP dry Plasma Removal of Photoresist / Plasma Photoresist removal (PR) machine for semiconductor wafer manufacture

ICP dry Plasma Removal of Photoresist / Plasma Photoresist removal (PR) machine for semiconductor wafer factory

Specification

PLASMA			RF	RF
Power	ICP	1000w	1000w
Power		BIAS	600w(option)	600w(option)
Applicable scope			4~8 inch	4~8 inch
Single processing slice count			1	2
Appearance dimensions			1080x1840x1800mm	1340x2050x1800mm
System control			Industrial control system	Industrial control system
Automation level			automatic	automatic