Guangzhou Minder-Hightech Co.,Ltd.
EN
Guangzhou Minder-Hightech Co.,Ltd.
Get Quote

Guangzhou Minder-Hightech Co.,Ltd.

Home
About Us
MH Equipment
Solution
Oversea Users
Video
Contact Us
Home> Wire Bonder
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Get a Free Quote
Product Description

LED/IC Wire Bonding
Special Measurement Microscope

——Loop Height / Mashed Ball Thickness / Ball Diameter Measuring
——Die adhesive thickness / Die Height / Adhesive Dispensing Thickness Measuring
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
product details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Specification
measuring times
D1
D2
D3
D4
D5
1
0.152
0.017
0.277
0.028
0.033
2
0.152
0.018
0.278
0.031
0.035
3
0.152
0.019
0.277
0.03
0.033
4
0.153
0.018
0.277
0.029
0.033
5
0.151
0.019
0.275
0.029
0.033
6
0.152
0.019
0.277
0.031
0.034
7
0.152
0.019
0.276
0.03
0.033
8
0.153
0.019
0.278
0.03
0.034
9
0.151
0.018
0.277
0.03
0.035
10
0.153
0.018
0.277
0.031
0.033
Repeatability
0.002
0.002
0.003
0.003
0.002
Packing & Delivery
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Company Profile
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture

1.  Are you the manufacturer?
Yes, our factories located in Guangzhou and Shenzhen. We can offer OEM and ODM services.


2.  What's your MOQ?
We have no MOQ for this item, we can customize for one-piece order according your requirement.


3.  What's your payment terms?
Normally we can work on T/T, VISA, Mastercard, West Union, PayPal.


4.  Your products have certificates?
Most our products are complied with CE.


5.  How to make an order? What's the lead time?
Our standard machines take 7-15 days; Customized Item takes about 20-30 days.


6.  Can I visit your factory before order?
Yes, welcome to visit our factory.


7.  Can you provide sample before a regular order?
Sure, we accept sample order.

Minder-High-tech has come up with a revolutionary product that is sure to take the LED and IC industry by storm. Their latest innovation is an LED/IC Wire Bonding Wire Bonder Special Measurement Microscope Bond Pull Tester. This product is designed to offer accurate, precise and reliable testing and measurement of wire bonding integrity.

 

May be the product is perfect any manufacturer looking for a tool that will help them maintain quality control. It is especially useful for manufacturers in the LED and IC industry who require to make certain wire bonding integrity. This revolutionary product is specifically designed to check the bond strength between the wire and also the device, and determine the pull force required to break the bond.

 

High precision measurement. This tool makes usage of advanced microscopy is optical to provide high-resolution images of the wire bonding program. Furthermore, the device comes with a software is advanced that provides real-time data analysis and graphical representation of the results.

 

Another feature is its user-friendly interface. The product comes with a touch is fully integrated display which makes it easy to navigate and operate. Additionally, the device is designed to be lightweight and compact, making it easy to transport and create.

 

Minder-High-tech has utilized only the standard materials which are highest to manufacture this system. It is built to withstand years of use in a production environment without requiring any upkeep is regular. The LED/IC Wire Bonding Wire Bonder Special Measurement Microscope Bond Pull Tester is a durable and device is reliable will certainly be an indispensable component of any LED or IC manufacturing process.

 

If you are in the LED or IC manufacturing business, this is a product that you need to consider investing in. 


More Products

Inquiry

Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved

Privacy Policy

Inquiry Email WhatsApp WeChat
Top
×

Get in touch