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Guangzhou Minder-Hightech Co.,Ltd.
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  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

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Product Description

Welding principle:

This machine uses the principle of ultrasonic friction to realize the surface welding of different media, which is a physical
change process.  
First, the first end of the gold wire must be processed to form a spherical shape (this machine adopts negative electron high pressure to form a ball), and the welded metal surface is pre-heated；Then, under the combined action of time and pressure, the gold wire ball produces spontaneous deformation on the metal welding surface, so that the two media can reach reliable contact, and through ultrasonic friction vibration, the two metal atoms are formed under the action of atomic affinity. The metal bond realizes the welding of the gold wire lead.  
Gold wire ball bonding is superior to silicon-aluminum wire bonding in terms of electrical properties and environmental

applications. However, since the welding parts made of precious metals must be heated, the application range is relatively narrow.


Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Applications
Gold wire ball bonding machine is mainly used for LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.
Sample
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Specification
electric requiement
220VAC±10％、50HZ、be sure connected to ground
wire diameter
17～50μm
ultrasonic power
0－3W, two channel. can be set separately of the two point
bond time
0－200ms，two channel
bond force
35－180g，two channel
digital camera systerm
optional
min bonding time
0.4s/wire
span between first bond to second bond by automatic mode
more than 4mm
length of terminal wire
0-2mm
ball dimension
2-4 times bigger setable
bond temperature
house temperature ~ 400℃
jig moving area
Φ25mm
microscope
15X,30X
dimension
700*460*550mm
weight
28kg
Packing & Delivery
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Company Profile
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire); Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
FAQ


Who are you and what's your address? We are Zhejiang Weinuo Technology Co., Ltd located in Yangguang Industrial Zone, Dipu Town, Anji County, Huzhou City, Zhejiang Province, China.

 

What products do you have? We specialize in Gaming Chairs, Racing Chairs, Office Chairs, Gaming Sofas, and Gaming Desks.

 

Can I get a sample? Yes, you can. We offer sample services with a limit of up to two pieces per buyer. The buyer is responsible for paying the sample and freight fees.

 

Can I customize products? Absolutely. We offer customization options for the color, material, and logo of the chair, as well as customization of the base, recliner, armrest, mechanism, and castors.

 

What is your Minimum Order Quantity and Payment Terms? Our MOQ is 1 piece, and for total fees under $3000, we require 30% payment via T/T in advance with the balance due before shipment. We also accept other payment terms including Visa, PayPal, Western Union, and L/C.

 

What's your loading port? Our usual loading ports are Shanghai or Ningbo.



Introducing the Minder-Hightech Manual wire ball bonder, the MDBB-1750, the perfect solution for all your wire bonding needs. This machine is specially designed for LED chips, diode laser tubes, inner leads, semiconductors, and other related applications. With its advanced technology, this wire bonder is capable of producing accurate and reliable wire bonding with gold wire, making it the perfect choice for your next project. 

At Minder-Hightech, we understand the importance of precision within the manufacturing procedure, which is why this gold cable bonding machine comes with advanced features to make certain accurate and operation is efficient. The MDBB-1750 is made by having a motor is high-speed enables fast and precise movement of the bonding capillary. The machine also features a clamping is robust that ensures your workpiece remains in destination through the wire bonding process. 


Comes with a user-friendly interface that makes it an easy task to operate, even for novice users. Its higher level display is digital one to monitor wire bonding progress in real-time, ensuring that work is always on course. Every time along with its simple yet intuitive controls, you can very quickly adjust the bonding parameters to fit your specific requirements, providing accurate and consistent results. 


At Minder-Hightech, we're committed to offering you a device is high-quality suits your requirements. The MDBB-1750 is manufactured of durable materials that ensure long-term use. Its compact design takes up room is minimal thus making it perfect for small workspaces. Additionally, the machine is made to be effortless to keep, and that means you can spend more time taking care of your projects and less time fretting about device maintenance. 


Invest in this Minder-Hightech Manual wire ball bonder MDBB-1750 today and experience the difference in quality and efficiency it can bring to your manufacturing process. 


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