Minder-Hightech
MD-039 Automatic to46 detector packaging high speed welding wire bonder wire bonding machine detector packaging rate cable high cable bonding device is merely a top-of-the-line item created for efficient and exact cable bonding operations. This product can be a device vital organization into the semiconductor industry need automated bonding procedures for their to46 detector packaging.
The MD-039 Automatic to46 detector packaging high speed welding wire bonder wire bonding machine revolutionary design simplifies the bonding procedure and streamlines manufacturing, eliminating expensive mistakes and manufacturing time reducing.
Featuring its abilities are Minder-Hightech high-speed organizations will get remarkable outcomes, as this device has a bonding unparalleled as high as 6 wires per second., the MD-039 improves effectiveness, because it calls for user minimal and will accommodate a range of cable diameters which range from 17 to 50 micrometers.
The MD-039's cutting-edge technology eliminates the requirement for handbook intervention, permitting unattended manufacturing, which dramatically decreases work expenses. The product comes with an eyesight high-precision ensures the partnership location is accurate, leading to supreme quality products and services.
Minder-Hightech's MD-039 is versatile and perfect for an assortment wide of because of its higher-level functionality. This has software easy-to-use enables users to modify parameters, along with its memory integrated function quality control is better than in the past.
The MD-039's tiny size enables it to accommodate into restricted areas, rendering it a good investment great space-conscious company. The merchandise can be efficient in power usage given it uses power small functions in a fashion sustainable.
Minder-Hightech's MD-039 Automatic to46 detector packaging welding bonder high-speed bonding device is sold with excellent support, including a seasoned technical group to make installation and advice about any technical problems. The MD-039 works closely with numerous languages, permitting a person improved throughout the world.
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Specification | ||
Bonding Capability | 48ms/w(2mm Wire Length) | |
Bonding Speed | +/-2Ym | |
Wire Length | Max 8mm | |
Wire Diameter | 15-65ym | |
Wire Type | Au, Ag, Alloy, CuPd, Cu | |
Bonding Process | BSOB/BBOS | |
Looping Control | Ultra Low Looping | |
Bonding Area | 56*80mm | |
XY Resolution | 0.1um | |
Ultrasonic Frequence | 138KHZ | |
PR accuracy | +/-0.37um | |
Applicable Magazine | ||
L | 120-305mm | |
W | 36-98mm | |
H | 50-180mm | |
Pitch | Min 1.5mm | |
Applicable Leadframe | ||
L | 100-300mm | |
W | 28-90mm | |
T | 0.1-1.3mm | |
Conversion Time | ||
Different Leadframe | ||
Same Leadframe | ||
Operation Interface | ||
MMI Language | Chinese, English | |
Dimension, Weight | ||
Overall Dimension W*D*H | 950*920*1850mm | |
Weight | 750KG | |
Facilities | ||
Voltage | 190-240V | |
Frequency | 50Hz | |
Compressed Air | 6-8Bar | |
Air Consumtion | 80L/min |
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