This die bonder is high precision die bonder use for high requirment die bonding, it first picking die by swing to a holder, which can calibrate the angle, and then re-pick to the lead frame by linear guide.
Description | MD-1412 Die Bonder Machine | |
UPH | 5 ~ 6K（swing arm and linear motion) | |
Placement accuracy | ±25um | |
Die rotation | +/- 2° | |
Die size | 6553 Sensor die:2.12*212mm 6100 Sensor die:1.65*1.65mm 3224 Asic die:1.20*1.27mm I-Lite Asic die:1.96*1.51mm | |
Bondline thickness control | Yes, Pressure control mode | |
Substrate size | ||
Length | 76(Can be customized according to customer requirements) | |
Width | 101(Can be customized according to customer requirements) | |
Thickness | (Can be customized according to customer requirements) | |
Wafer system | ||
Standard | Contains 12-inch wafer ring mechanism and chip box clamping mechanism; thimble assembly; XY table;10 inch, 12 inch, 14 inch metal frame fixture, manual adjustment;Standard dispensing needle adhesive dispensing | |
6"wafer size [ 10" metal frame ] 8"wafer size [ 12" metal frame ] 12"wafer size [ 14" metal frame ] | ||
Facilities required | ||
Voltage | 220 VAC | |
Full load current | NA | |
Frequency | 50Hz | |
Power consumption | 600 ~ 1000W | |
Compressed air | Min 6 bar [ 87psi ] | |
Dimension & Weight | ||
W x D x H | 2000mm x 1200mm x 1800mm | |
Weight | 1700kg | |
Introducing the MD-1412 MDAX64DI High Precision Die Bonder from Minder-High-tech, the perfect solution for IC/TO Package Line Die Bonding. Designed with precision and accuracy in mind, this die bonder offers exceptional performance and reliability to meet the most demanding requirements of your application.
Designed with advanced technology, this is capable of handling an array of materials IC is including TO packages as well as other elements. The equipment comes by having a platform is large multiple ejector pins enabling for quick and easy handling associated with die. The system features a camera is integrated that insures a higher quality level control, giving you the self-confidence that your die will be perfectly put each time.
Built with an engine is powerful provides high precision and speed. With a maximum bond force of 50N and a precision of 0.001mm, the device can manage the most bonding is challenging with ease. The machine is perfect for a range is wide of including automotive, aerospace, medical and other companies.
Designed with all the operator at heart, this features a user interface is user-friendly is quick and easy to use. The machine includes an impression is large display that provides intuitive operation and quick access to various settings and functions. Also, the machine includes a range is wide of features that ensure operator safety while using the equipment.
Created with top-quality materials and components permitting long-lasting reliability and performance is exceptional. The equipment is designed to withstand harsh environments that are working can run for extended periods with no need for regular maintenance. Additionally, the device is easy to clean and keep, allowing for quick and cleaning is easy each use.
The MD-1412 MDAX64DI High Precision Die Bonding machine from Minder-High-tech is an exceptional choice for IC/TO Package Line Die Bonding.
Guangzhou Minder-Hightech Co.,Ltd.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved
EN
AR
BG
CS
DA
NL
FI
FR
DE
EL
IT
KO
NO
PL
PT
RO
RU
ES
SV
TL
IW
ID
LT
SR
SL
UK
VI
ET
HU
TH
TR
FA
AF
MS
GA
IS
HY
AZ
KA
