Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials. Main Features Spindle unit： It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.
Specification
Main technical parameters
Maxima Diameter of Cutting Ingot: ＜￠100mm Blade Standard: φ422mm×φ152mm×0.15mm □Maximal Length of Cutting Ingot: 350mm Cutting feeding speed: 1〜99mm/min Cutting Return Speed:1〜999mm/min Stepping deviation of feeding system: ±0.007mm(testing with l mm feeding step) Range of Wafer Thickness: 0.001〜40.00mm Adjustment of Crystal Direction: Horizontal range（x）±7°（resolution:2')Vertical range（Y）±7º （resolution：2'） Power：2.5kw 〜380v±38v 50HZ±1HZ Source of Air：0.4〜0.5MPa □Touching Panel：5.7inch Dimension: 1100mm×660mm×2230mm □Weight：1100kg Optional Solution： ￠422mDeep blade plate for Range of wafer thickness maximal 58.000mm ￠457mm blade plate for range of ingot diameter maxma1￠105mm
Packing & Delivery
Company Profile
We have 16 years of experience in equipment sales.
We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
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