Designed for automatically slicing semiconductor material, glass, ceramic, lithium tantalite and lithium columbate and other hard or fragile materials. Main Features Spindle unit： It adopts vertical spindle design. It uses radial ball bearing to increase the rigidity, precision and life. Its vibration is small. Worktable unit Worktable use high precision linear guideway an AC servo system. The range of speed is wide and the low speed performance is better. It can satisfy requirements of different materials. Feeding unit Feeding system uses step motor and driving system to improve stability and precision.
Specification
Main technical parameters
Maximal Diameter of Cutting Ingot: ￠153mm Blade Standard:￠690mm×￠241mm×0.15mm or ￠690mm× ￠235mm×0.15mm Maximal Length of Cutting Ingot:400mm Cutting speed:0.2〜99mm/min □Return Speed:1〜1000mm/min The speed of main spindle:1420r/min Stepping deviation of feeding :±0.005mm(testing with l mm feeding step) Range of Wafer Thickness:0.001〜68.00mm Adjustment only of Crystal Direction:0.001mm Adjustment of Crystal Direction: Horizontal range（x）±7°（resolution：2') Vertical range（Y）±7º（resolution：2'） Power：3.5kw,〜380v±38v, 50HZ±1HZ Source of Air：0.4〜0.5MPa,250L/min(instantaneous flux when braking) Sour of cooling water:0.2〜0.4mpa;5L/min Touching Panel： 7.7inch Dimension:645mm×925mm×2820mm Weight:2500kg
Packing & Delivery
Company Profile
We have 16 years of experience in equipment sales.
We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
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