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  • MD-BT104 Multifunctional Pull Tester for Wire Bonding Test
  • MD-BT104 Multifunctional Pull Tester for Wire Bonding Test
  • MD-BT104 Multifunctional Pull Tester for Wire Bonding Test
  • MD-BT104 Multifunctional Pull Tester for Wire Bonding Test
  • MD-BT104 Multifunctional Pull Tester for Wire Bonding Test
  • MD-BT104 Multifunctional Pull Tester for Wire Bonding Test

MD-BT104 Multifunctional Pull Tester for Wire Bonding Test

Application Area

Semiconductor packaging
TO series packaging
Military components
LED packaging
IGBT packaging
Microelectronic packaging
MD-BT104 The multifunctional push-pull testing machine is widely used in applications such as LED packaging testing, IC
semiconductor packaging testing, TO packaging testing, IGBT power module packaging testing, optoelectronic component packaging testing, automotive, aerospace, military product testing, research institutions' testing, and various universities' testing and research
MD-BT104 Multifunctional Pull Tester for Wire Bonding Test manufacture
MD-BT104 Multifunctional Pull Tester for Wire Bonding Test manufacture
MD-BT104 Multifunctional Pull Tester for Wire Bonding Test details
MD-BT104 Multifunctional Pull Tester for Wire Bonding Test details
Specification
Equipment Function Introduction
The overall structure of the equipment adopts a five axis positioning control system, with X-axis and Y-axis travel of 100mm and
Z-axis travel of 80mm. Combined with the unique design of ergonomics and comprehensive protection measures, the left and right
Hall rockers control the free movement of the XYZ platform, making operation simpler, more convenient, and more user-friendly.
The sturdy body design can reach up to 200KG, with a maximum testing force of 100KG for the Y-axis and 20KG for the Z-axis.
The intelligent workstation automatic replacement system reduces the complexity of manually replacing modules, while also
improving the efficiency and convenience of testing.
High precision dynamic sensing combined with unique mechanical algorithms enables each sensor to adapt to precise testing in
different environments and ensure the accuracy of testing accuracy.
LED intelligent lighting control system, when the equipment is idle, the lighting lights automatically turn off, and when
personnel operate, the LED lighting lights turn on.
Device Software
Chinese and English software interface, three-level operation permissions, and all levels of operation permissions can be freely
set
Force units Ka, g, N, can be selected according to testing needs
The software can output real-time histograms and force curves of test results, and has the function of saving and exporting test
data in real time. The test data can also be connected to the MES system in real time.
The software can set standard values and directly output test results, automatically judging the test results.
SPC data export comes with maximum, minimum, average, and CPK calculations for the current exported data
Sensor accuracy
Sensor accuracy ± 0.003%: comprehensive testing accuracy ± 0.25%.
Testing accuracy
Test sensor range automatic switching.
Multiple point linear accuracy correction and repeatability testing using standard method codes to ensure the accuracy of sensor
test data
Software parameter settings
According to the permissions at all levels, parameters such as qualified force value, shear height, and testing speed can be
adjusted.
Testing Platform
The vacuum 360 degree free rotation testing platform is suitable for various material testing needs, and can easily meet the
testing needs of various materials by replacing the corresponding fixtures or pressure plates.
Packing & Delivery
MD-BT104 Multifunctional Pull Tester for Wire Bonding Test details
MD-BT104 Multifunctional Pull Tester for Wire Bonding Test supplier
Company Profile
We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
MD-BT104 Multifunctional Pull Tester for Wire Bonding Test details

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