Inner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material. Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating, the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product. We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models. For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time
Specification
Main technical parameters
Main technical parameters Max machining size(mm):φ115 ×80mm Cutting speed (㎝²/㎜):3-6(㎝²／㎜) Degree of balance sheets by cutting deviation（mm)： ±0.005㎜ Cutting film thickness(mm):≥0.30 The thin-cut tolerance (mm):±０.005㎜ Horizontal stroke（mm):120㎜ Longitudinal travel(mm):110㎜ Longitudinal degrees:0-100Grid, each grid To 0.01,Each turn a lap in order to1㎜ Spindle Electrical:3 Phase 380V 1.5kw Spindle Speed (r/min):3500Rev /min Adjust the amount of work table: Horizontal angle:±45º Pitch angle of elevation:±10º Vertically（mm):24 Cooling tank capacity（kg） :50kg Cooling tank motor: 3 Phase 380V 0.12kw 2780r/min Power:Three-phase four-wire 50Hz 380V Dimensions(mm):1200 ×900 ×1600 Weight（kg):~1600（kg）
Packing & Delivery
Company Profile
We have 16 years of experience in equipment sales.
We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
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