Inner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material. Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating, the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product. We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models. For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time
Specification
Max machining size（mm） :φ95 ×80mm Cutting speed （㎝²／㎜）： 3-6（㎝²／㎜） Degree of balance sheets by cutting deviation（mm)： ±0.005㎜ Cutting film thickness（mm)： ≥０.３０ The thin-cut tolerance（mm） :±０.005㎜ Horizontal stroke（mm):120㎜ Longitudinal travel（mm） :110㎜ Spindle Electrical:3 Phase 1.1kw Spindle Speed （r/min):2800Rev / min Adjust the amount of work clamp: Horizontal angle:±45º Pitch angle of elevation:±10º Vertically（mm):20 Cooling tank capacity（kg） :50kg Cooling tank motor: 3 Phase 0.12kw 2780r/min Power:Three-phase four-wire 50Hz 380V Dimensions(mm):1130 ×850 ×1500 Weight（kg):~1400（kg）
Packing & Delivery
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Company Profile
We have 16 years of experience in equipment sales.
We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
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