MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED

Minder-Hightech

The MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED is truly a top-of-the-line cable ball bonding device specifically made to appeal to your requirements of those in to the electronic devices industry, especially those working together with IC LED. 

This device boasts of enhanced functions permit high accuracy cable bonding, will be an element essential production electronic. The MD-S automated semiconductor device cable ball bonder can manage many cable diameters without compromising in connection with relationship quality having its exemplary abilities. 

The MD-S automated semiconductor device cable ball bonder is easy to get results and will be offering many functionalities are user-friendly help efficient and procedure seamless. Furthermore, Minder-Hightech has made security important integrating top security features steer clear of the accidental procedure for the product by unauthorized workers. 

The Minder-Hightech MD-S semiconductor automated cable ball bonder is a versatile device provides various kinds of cable bonding applications. Its abilities make it appropriate Light-emitting Diode illumination automotive house smart, and commercial illumination applications. Furthermore, the device might manage a number of package kinds, including PQFN, QFN, and SOT. 

The MD-S semiconductor automated cable ball bonder deals with the unique procedure called thermionic wire bonding, which guarantees exemplary relationship quality and dependability. This technique involves the utilization of ultrasonic waves to help make a relationship betwixt your cable component, supplying a hyperlink robust is resistant to vibrations and shocks. 

Another function noteworthy of device is its improved efficiency. The MD-S automated semiconductor device cable ball bonder provides throughput excellent making this a great addition for those of you doing work in production environments needing a high wide range of cable bonding having an interval period of 0.8 moments.