Guangzhou Minder-Hightech Co.,Ltd.
EN
Guangzhou Minder-Hightech Co.,Ltd.
Get Quote

Guangzhou Minder-Hightech Co.,Ltd.

Home
About Us
MH Equipment
Solution
Oversea Users
Video
Contact Us
Home> Wire Bonder
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Get a Free Quote
Product introduction 

 MDDAB-2550 Deep access wedge bonder

Special for deep access bonding design in wire bonding. Reach depth about 20mm pending.
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Specification
electric requirement
220VAC±10％、50HZ、60W be sure connected to ground
wire diameter
25～50µm
ultrasonic power
0－3W, 60kHz, two channel. can be set separately of the two point
bond time
5－200ms，two channel
bond force
10－60g，two channel
span between first bond to second bond by automatic mode
0-10mm(motorized) 
bond radian
0-6mm(motorized) 
jig moving area
Φ16mm
mouse hand
20*20mm
digital camera
optional
dimension
600*560*390mm
weight
36kg
Product details 
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufacture
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Customer useing 
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory
Factory 
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Packing 
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory

Product introduction 

 MDDAB-2550 Deep access wedge bonder 

Special for deep access bonding design in wire bonding.  Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factoryDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplierSpecification 

electric requirement220VAC±10％、50HZ、60W be sure connected to ground
wire diameter25～50µm
ultrasonic power0－3W, 60kHz, two channel. can be set separately of the two point
bond time5－200ms，two channel
bond force10－60g，two channel
span between first bond to second bond by automatic mode0-10mm(motorized) 
bond radian0-6mm(motorized) 
jig moving areaΦ16mm
mouse hand20*20mm
digital cameraoptional
dimension600*560*390mm
weight36kg


Product details

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufactureDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine detailsDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplierDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier

Customer useingDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufactureFactoryDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufactureDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine detailsPackingDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufactureDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory

The MDDAB-2550 Deep access wedge bonder is the perfect machine for all your wire bonding needs. This state-of-the-art machine is designed and manufactured by Minder-Hightech, a leading company in the field of wire borders, specializing in deep access bonding. 


An advanced cable bonding device is designed to provide bonding performance is superior. The machine is built with something is dependable delivers high-quality bonding results. It features an design is ergonomic which enables easy operation, making it a great machine for both novice and experienced operators. 


Specially designed for deep access bonding. The machine's specialized features give it time to access hard-to-reach areas, making it the right choice for any access bonding application is deep. Its design is exclusive allows to bond wires in tiny spaces, making it ideal for use in the microelectronics industry. 


One of many key features is its control is advanced level system. The device comes prepared with a completely automated system that enables the operator to control all areas of the bonding process. This feature ensures that the bonds are of top quality and constant throughout the method. 


Features a bonding system is high-speed. This system ensures that the device can connect wires efficiently and rapidly, reducing production time. The device is manufactured by this particular feature ideal for big scale production in companies such as for example aerospace, automotive, and medical. 


Constructed of high-quality materials and is built to final. It features a framework is sturdy a durable bonding head is resistant to wear and tear. This ensures that the machine will perform well even in probably the most environments which can be demanding. 


Contact us today to learn more about this exceptional MDDAB-2550 Deep access wedge bonder and take your wire bonding to the next level. 



More Products

Inquiry

Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved

Privacy Policy

Inquiry Email WhatsApp WeChat
Top
×

Get in touch