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  • MDHWS661 Ultrasonic Inspection System Scanning Acoustic Microscope
  • MDHWS661 Ultrasonic Inspection System Scanning Acoustic Microscope
  • MDHWS661 Ultrasonic Inspection System Scanning Acoustic Microscope
  • MDHWS661 Ultrasonic Inspection System Scanning Acoustic Microscope

MDHWS661 Ultrasonic Inspection System Scanning Acoustic Microscope

Product Description

MDHWS661 Ultrasonic Scanning Acoustic Microscope

MDHWS661 series ultrasonic scanning microscope is a kind of non-destructive testing imaging equipment using ultrasound as the propagation medium. lt mainly uses high-frequency ultrasound to detect all kinds of semiconductor devices and materials, and can detect the defects such as pores, cracks, inclusions and delamination inside the sample, and display them in a graphical way. ln the scanning process, it will not cause damage to the sample, will not affect the performance of the sample, and can effectively
meet the needs of new energy, semiconductor, power electronics, thermal management materials, diamond composite materials carbon fiber composite materials and other industries.
Feature
1. With A scan, B scan, C scan, transmission scanning (need to configure transmission scanning unit and receiving probe options) multi-layer scanning, tray scanning, thickness measurement and other series of scanning modes,
2. With quantitative measurement and analysis function, visually display the position, shape and size of the internal defects of the tested parts in the form of images, and carry out the size and area statistics of the defects, and automatically calculate the percentage of defects in the measured area; With defect size identification; Thickness and ranging functions.
3. With image coloring function, can automatically color according to phase reversal; Manual coloring according to gray level; Automatic coloring according to thickness changes.
4. Suitable for the rapid scanning analysis of a single device, can also be placed in batches of samples synchronous defect identification, quickly screen out unqualified products.
5. Compatible with 1-230MHz ultrasonic probe.
6. Testing software independent research and development, English and Chinese interface, can be continuously upgraded according to customer needs.
Specification
Applications
lithium battery, plastic sealed IC, photoelectric device, microwave power device, MEMS device, flip chip, Stacked Die, MCM multi-chip module, diamond composite sheet, electrical welding parts, ceramic materials, etc.
Packing & Delivery
Company Profile
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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