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  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry
  • MDHYDS12B 12 inch Discing Saw for Semiconductor Industry

MDHYDS12B 12 inch Discing Saw for Semiconductor Industry

Product Description

Application

IC,Optical Optoelectronics,Communications,LED package,QFN package,DFN package,BGA package

Material suitable:

Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board
MDHYDS12B 12 inch Discing Saw for Semiconductor Industry supplier
MDHYDS12B 12 inch Discing Saw for Semiconductor Industry factory
MDHYDS12B 12 inch Discing Saw for Semiconductor Industry supplier
Specification
MDHYDS8FA
MDHYDS12B
MDHYDS12FA
Multi plate dicing
Auto focus
Auto align
Shape recognition
*
*
*
Dicing mark check
*
*
*
Non contact height test
Blade broken check
*
*
*
Dual camera align system
MDHYDS8FA
MDHYDS12B
MDHYDS12FA
Spec
dicing size
mm
ф8”〡□250
ф12”〡□300
ф420”〡□360
ф12”〡□275
dicing depth
mm
≤4mm or custom
≤4mm or custom
≤4mm or custom
Main spindle
rotaty speed
minˉ¹
6000∽60000
6000∽60000
6000∽60000
power
kW
DC,2.4at60000minˉ¹
DC,2.4at60000minˉ¹
DC,2.4at60000minˉ¹
X axis
stroke
mm
260
310
450
310
speed range
mm/s
0.1∽600
0.1∽800
0.1∽1000
Y axis
stroke
mm
260
170
310
resolution
mm
0.0001
310
450
0.0001
single move accuracy
mm
≤0.002/5
≤0.002/5
≤0.002/5
F accuracy
mm
≤0.005/260
≤0.005/310
≤0.005/310
Z axis
stroke
mm
40
40
40
max blade size:
mm
ф58
ф58
ф58
resolution
mm
0.00005
0.00005
0.00005
accuracy
mm
0.001
0.001
0.001
R axis
rotary range
deg
380
380
380
Basic required
power
KVA
4.0(three phase,AC380V)
5.0(three phase,AC380V)
7.0(three phase,AC380V)
air
Mpa L/min
0.5∽0.6max consumption260
0.5∽0.6max consumption400
0.5∽0.6max consumption550
cutting fluid
Mpa L/min
0.2∽0.3max consumption4.0
0.2∽0.3max consumption7.0
0.2∽0.3max consumption9.0
cooling water
Mpa L/min
0.2∽0.3max consumption1.5
0.2∽0.3max consumption3.0
0.2∽0.3max consumption3.0
exhaust
m³/min
5.0
8.0
8.0
size
mm
900*1050*1800
1170*1030*1850
1380*1300*1850
1200*1600*1800
weight
kg
1050
1400
1550
2000
Factory View
MDHYDS12B 12 inch Discing Saw for Semiconductor Industry factory
Packing & Delivery
MDHYDS12B 12 inch Discing Saw for Semiconductor Industry factory
MDHYDS12B 12 inch Discing Saw for Semiconductor Industry supplier
Company Profile
We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
MDHYDS12B 12 inch Discing Saw for Semiconductor Industry factory

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