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  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry
  • MDHYDS6M 6inch Dicing saw for Semiconductor Industry

MDHYDS6M 6inch Dicing saw for Semiconductor Industry

Product Description

Application

IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc.

Material suitable:

Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.
MDHYDS6M 6inch Dicing saw for Semiconductor Industry details
MDHYDS6M 6inch Dicing saw for Semiconductor Industry manufacture
MDHYDS6M 6inch Dicing saw for Semiconductor Industry supplier
Specification
MDHYDS6L
MDHYDS6M
MDHYDS6H
Multi plate dicing
Auto focus
Auto align
*
*
Shape recognition
-
-
*
Dicing mark check
-
*
*
Non contact height test
-
*
Blade broken check
-
*
*
Dual camera align system
-
*
MDHYDS6L
MDHYDS6M
MDHYDS6H
Spec
dicing size
mm
ф6”〡□150
ф6”〡□150
ф6”〡□150
dicing depth
mm
≤4mm or custom
≤4mm or custom
≤4mm or custom
Main spindle
rotaty speed
minˉ¹
3000∽40000
10000∽50000
10000∽50000
power
kW
AC,1.25at40000minˉ¹
AC,1.5at50000minˉ¹
DC,1.5at50000minˉ¹
X axis
stroke
mm
250
250
250
speed range
mm/s
0.1∽400
0.1∽400
0.1∽500
Y axis
stroke
mm
170
170
170
resolution
mm
0.0001
0.0001
0.0001
single move accuracy
mm
≤0.003/5
≤0.003/5
≤0.002/5
F accuracy
mm
≤0.005/170
≤0.005/170
≤0.004/170
Z axis
stroke
mm
30
30
30
max blade size:
mm
ф58
ф58
ф58
resolution
mm
0.0001
0.0001
0.0001
accuracy
mm
0.001
0.001
0.001
R axis
rotary range
deg
380
380
380
Basic required
power
KVA
3.0(single phase,AC220V)
3.0(single phase,AC220V)
3.0(single phase,AC220V)
air
Mpa L/min
0.5∽0.6max consumption180
0.5∽0.6max consumption200
0.5∽0.6max consumption200
cutting fluid
Mpa L/min
0.2∽0.3max consumption3.0
0.2∽0.3max consumption3.5
0.2∽0.3max consumption3.5
cooling water
Mpa L/min
0.2∽0.3max consumption1.5
0.2∽0.3max consumption1.5
0.2∽0.3max consumption1.5
exhaust
m³/min
1.5
1.5
1.5
size
mm
580*910*1650
580*910*1650
580*910*1650
weight
kg
500
500
500
Factory View
MDHYDS6M 6inch Dicing saw for Semiconductor Industry details
Packing & Delivery
MDHYDS6M 6inch Dicing saw for Semiconductor Industry factory
MDHYDS6M 6inch Dicing saw for Semiconductor Industry factory
Company Profile
We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
MDHYDS6M 6inch Dicing saw for Semiconductor Industry details

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