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  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry
  • MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry

MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry

Product Description

Application

IC,Optical Optoelectronics,Communications,LED package,QFN package,DFN package,BGA package

Material suitable:

Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board
MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry details
MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry factory
MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry details
Specification
MDHYDS8FA
MDHYDS12B
MDHYDS12FA
Multi plate dicing
Auto focus
Auto align
Shape recognition
*
*
*
Dicing mark check
*
*
*
Non contact height test
Blade broken check
*
*
*
Dual camera align system
MDHYDS8FA
MDHYDS12B
MDHYDS12FA
Spec
dicing size
mm
ф8”〡□250
ф12”〡□300
ф420”〡□360
ф12”〡□275
dicing depth
mm
≤4mm or custom
≤4mm or custom
≤4mm or custom
Main spindle
rotaty speed
minˉ¹
6000∽60000
6000∽60000
6000∽60000
power
kW
DC,2.4at60000minˉ¹
DC,2.4at60000minˉ¹
DC,2.4at60000minˉ¹
X axis
stroke
mm
260
310
450
310
speed range
mm/s
0.1∽600
0.1∽800
0.1∽1000
Y axis
stroke
mm
260
170
310
resolution
mm
0.0001
310
450
0.0001
single move accuracy
mm
≤0.002/5
≤0.002/5
≤0.002/5
F accuracy
mm
≤0.005/260
≤0.005/310
≤0.005/310
Z axis
stroke
mm
40
40
40
max blade size:
mm
ф58
ф58
ф58
resolution
mm
0.00005
0.00005
0.00005
accuracy
mm
0.001
0.001
0.001
R axis
rotary range
deg
380
380
380
Basic required
power
KVA
4.0(three phase,AC380V)
5.0(three phase,AC380V)
7.0(three phase,AC380V)
air
Mpa L/min
0.5∽0.6max consumption260
0.5∽0.6max consumption400
0.5∽0.6max consumption550
cutting fluid
Mpa L/min
0.2∽0.3max consumption4.0
0.2∽0.3max consumption7.0
0.2∽0.3max consumption9.0
cooling water
Mpa L/min
0.2∽0.3max consumption1.5
0.2∽0.3max consumption3.0
0.2∽0.3max consumption3.0
exhaust
m³/min
5.0
8.0
8.0
size
mm
900*1050*1800
1170*1030*1850
1380*1300*1850
1200*1600*1800
weight
kg
1050
1400
1550
2000
Factory View
MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry factory
Packing & Delivery
MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry supplier
MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry manufacture
Company Profile
We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.
MDHYDS8FA 8 inch Discing Saw for Semiconductor Industry details

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