MDSY-ZQ6076 Wafer Level Ball Mounter , China MDSY-ZQ6076 Wafer Level Ball Mounter Manufacturers, Suppliers, Factory

Product Description

MDSY-ZQ6076 Wafer Level Ball Mounter details

Wafer level ball mounter MDSY-ZQ6076

1. Applicable wafer: 12’’ wafer & 8’’ wafer
2. Ball size: ф60[um]~ ф760 [um]、ф30 [um] in Lab test level
3. Wafer Bump:
a). Min. Bump pitch: 100 [um]
b). Min. Bump pad size: 85 [um]
c). Max. Bump count: 2.2KK [pins]
*The data is subject to device conditions
4. 12” Wafer case:
a). Min. Thickness: 200[μm]、100[μm] under lab test level
b). Max Warpage Tolerance：6 [mm]/凹case、3 [mm]/凸case
5. Ball mounting Ability
a). Flux Printing Accuracy
Over ф75[um] Ball: +25[um]
Less than ф75[μml Ball: +1/3 of ball diameter
b). Ball mounting Accuracy
Over ф75[um] Ball::±25[um]
Less than ф75[μml Ball: +1/3 of ball diameter
For special case, we can achieve：+13μm
c). Ball Mounting NG Ratio: Less than 30 [ppm]

MDSY-ZQ6076 Wafer Level Ball Mounter factory

MDSY-ZQ6076 Wafer Level Ball Mounter manufacture

MDSY-ZQ6076 Wafer Level Ball Mounter supplier

Specification

Wafer size	8、12 inch wafer
Ball size	Φ60um~Φ760um
Min. ball pitch	100um(Φ60um ball)
Alignment accuracy	±25um
Dimensions	3,595W x1,685D x1,650H [mm
Weight	2,600[kg]
Loader, Unloader	Open Cassette, FOSB, FOUP

Packing & Delivery

Company Profile

We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.