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  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine
  • MDZC-1000 Wafer Level Laser Solder Ball Placement Machine

MDZC-1000 Wafer Level Laser Solder Ball Placement Machine

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Product Description

MDZC-1000

Wafer level Laser Solder Ball Placement Machine
Laser solder ball placement (soldering) technology can be applied to both lead and lead-free solder balls; Such as SnPb (lead tin), AuSn (gold tin), AgSn (silver tin), SnAgCu (tin silver copper), etc.
Laser tin ball placement(soldering) technology can achieve tin ball welding with a minimum diameter of 60um and a maximum diameter of 2000um. According to customer products and requirements, there are multiple tin ball diameters to choose from.
Now, we already mass product 70um ball to wafer placement, and min60um for R&D usage.
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine details
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MDZC-1000 Wafer Level Laser Solder Ball Placement Machine details
Specification
Model number
MDZC-LBP500
MDZC-LBP1000
MDZC-LBP7076
Laser power
20w or 50w
100w
20w+100w(dual)
Laser wavelength
1064nm
Cooling method
Full air cooling
Placing ball diameter
200 um-760um
70 um-200um
70-760um
Motion control
PC+ motion control card
Positioning method
CCD positioning
2D inspection
Optional
Optional
Not available
Repetition precision
±5 um
±7um
±5um
Chuck table
Vacuum chuck
Process range
150*150mm
Ball planting efficiency
≥3 balls /S
Nozzle counterpoint
Automatic calibration
Power supply
AC220V 50Hz
Computer
I5 ,win10
Temperature and humidity
22-30°C 20-70% (non-condensating)
Weight
1200Kg
1600 kg
1700kg
Overall dimensions
1200(L)*1350(W)*1800(H)mm
Principle:
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine factory
Sample
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine factory
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine factory
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine factory
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine factory
Character
1,Small footprint (length x width=1200mm x 1300mm)
2,Equipped with safety grating to protect the safety of operators
3,Marble base, stable structure, guaranteed accuracy/speed
4,Optional standard tin ball diameter 250um-750um (one specification per 50um)
5,Optional microspheres (diameter 70um-200um)/large balls (diameter 800um-2000um); Need to confirm in advance
6,Independently developed software, easy to operate and quick to get started
7,The laser has a long lifespan, and imported lasers are used, with a lifespan of up to 100000 hours
8,Configure a laser power feedback system to achieve precise control of the laser
Packing & Delivery
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine factory
MDZC-1000 Wafer Level Laser Solder Ball Placement Machine manufacture
Company Profile
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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