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  • PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process
  • PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process
  • PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process
  • PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process
  • PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process
  • PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process

PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process

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Product Description

PECVD Plasma enhanced chemical vapor deposition equipment

◆ Fully automatic control of process time, temperature, gas flow, valve action and reaction chamber pressure is realized by
industrial computer.
◆ Imported pressure control system and closed loop system are adopted, with high stability.
◆ Imported corrosion-resistant stainless steel pipe fittings and valves are used to ensure the air tightness of the gas circuit.
◆ It has perfect alarm function and safety interlock device.
◆ It has ultra-high temperature alarm and under-temperature alarm, MFC alarm, reaction chamber pressure alarm, RF alarm, low compressed air pressure alarm, low N2 pressure alarm, and low cooling water flow alarm.
◆ The existing PECVD has the function of growing SiO2 film after upgrading, which solves the PID problem of battery module. SiNxOy film can be grown (back passivation process), which can greatly improve the conversion efficiency of the battery.
PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process supplier
PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process details
PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process factory

Type

◆ Loading quantity: 384 pieces/boat (125 * 125); 336 pieces/boat (156 * 156)
◆ Cleanliness of purification table: Grade 100 (Grade 10000 plant)
◆ Automation degree: automatic control of temperature and process.
◆ Chip sending and taking mode: soft landing type, with stable and reliable characteristics, no creeping, accurate positioning, large bearing capacity and long service life.
Specification
Maximum loading per tube
384 pieces/boat（125*125）
336 pieces/boat（156*156）
Process index
± 3% in tablet, ± 3% between tablets, ± 3% between batches
working temperature
200~500℃
Accuracy and length of temperature zone (static closed tube test)
1200mm±1℃
Gas flow accuracy
±1%FS
Air tightness of air circuit system
1×10-7Pa.m³/S
control
Fully imported automatic pressure closed-loop regulating system, precise control of reaction vacuum; 40KHz high-frequency power
supply; Craft boat soft landing; Full digital control, perfect and safe process control protection.
1 tube, 2 tubes, 3 tubes and 4 tubes are optional; The automatic loading manipulator is optional, and the equipment performance
and process performance can be can be comparable with the world's top similar equipment.
Packing & Delivery
PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process factory
PECVD Plasma enhanced chemical vapor deposition equipment / High temperature PECVD process manufacture
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Company Profile
We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.

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