Minder-Hightech
Buying a bonding dependable that delivers accuracy and rate? Look no further than the Precision Automatic High Speed Deep Access Wire Wedge ball Bonder Bonding machine for microwave product through the experts.
This device was created to deliver fast, accurate bonding for microwave oven services and products, utilizing high level technology to be sure perfect cable bonds each and every time. The Minder-Hightech bonding device provides unparalleled freedom and gratification insurance firms a deep-access design that may accommodate probably the many complex circuits. Probably the most function impressive of device is its rate.
Because of automation advanced optimized bonding processes, you'll attain up to 10 bonds per second, making this one of these quickest and most efficient bonding devices today available. This Minder-Hightech means you are going to raise your throughput, lower your expenses, and increase your manufacturing without having to sacrifice quality or accuracy.
The Precision Automatic High Speed Deep Access Wire Wedge ball Bonder Bonding machine for microwave product normally user friendly along with its rate and precision. a user-friendly graphical user interface, and simple setup procedures, you will get ready to go very quickly with intuitive settings. Plus, featuring its durable construction, durable elements, and upkeep low, this product was created to supply dependable performance for decades as time goes by. Therefore, regardless if you are caring for microwave oven products and services for telecommunications, radar systems, or almost any application that demands bonding top-notch the Precision Automatic High Speed Deep Access Wire Wedge ball Bonder Bonding machine for microwave product from Minder-Hightech could be the device perfect the work.
This product can help you reach your manufacturing objectives and remain before the competition which consists of unbeatable blend of rate, accuracy, and simplicity of good use. So just why wait? E-mail us right now for more information about any of it operational system exciting just take your bonding operations to a different location degree with Minder-Hightech.
Bonding Area | X*Y:150*120mm(Inline)150*225mm(Fixed workholder)Z:50mm |
Theta rotation | -360°~360° |
Placement precision | ±3um@3S ±0.00018°@3S |
Bond force | 1-300g precision0.1g programmable |
Wire | Au wire: 12-75um,Al wire: 20- 100um |
Ribbon | Au ribbon 25*12.7μm-250*25.4μm |
Deep Access | Compatible 16/19mm capillary |
EFO | 0~100mA,0~4000us programmable multi-Profile mode |
UPH | 2~7 wire per second |
Adaptability | 1-High efficient transducer,more reliable quality ofbond; | |
2-Table tear and Clamp tear; | ||
3-Sectionalized bonding parameter, for the different interface; | ||
4-Multi sub-program to be combined; | ||
5-SECS/GEM protocol; | ||
Stability | 6-Real time detection of wire deformation; | |
7-Real time detection of ultrasonic power; | ||
8-Second display screen; | ||
Consistency | 9-Constant loop height, loop length; | |
10-online BTO for wedge tool calibration by unlock video. |
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