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  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board
  • Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board

Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board

Products Description
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board manufacture
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board supplier
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board manufacture
Specification
MDHYDS6L
MDHYDS6M
MDHYDS6H
Spec
dicing size
mm
ф6”〡□150
ф6”〡□150
ф6”〡□150
dicing depth
mm
≤4mm or custom
≤4mm or custom
≤4mm or custom
Main spindle
 rotary speed
minˉ¹
3000∽40000
10000∽50000
10000∽50000
power
kW
AC,1.25at40000minˉ¹
AC,1.5at50000minˉ¹
DC,1.5at50000minˉ¹
X axis
stroke
mm
250
250
250
speed range
mm/s
0.1∽400
0.1∽400
0.1∽500
Y axis
stroke
mm
170
170
170
resolution
mm
0.0001
0.0001
0.0001
single move accuracy
mm
≤0.003/5
≤0.003/5
≤0.002/5
F accuracy
mm
≤0.005/170
≤0.005/170
≤0.004/170
Z axis
stroke
mm
30
30
30
max blade size:
mm
ф58
ф58
ф58
resolution
mm
0.0001
0.0001
0.0001
accuracy
mm
0.001
0.001
0.001
R axis
 rotary range
deg
380
380
380
Basic required
power
KVA
3.0single phase,AC220V
3.0 single phase,AC220V
3.0 single phase,AC220V
air
Mpa L/min
0.5∽0.6max consumption180
0.5∽0.6max consumption200
0.5∽0.6max consumption200
cutting fluid
Mpa L/min
0.2∽0.3max consumption3.0
0.2∽0.3max consumption3.5
0.2∽0.3max consumption3.5
cooling water
Mpa L/min
0.2∽0.3max consumption1.5
0.2∽0.3max consumption1.5
0.2∽0.3max consumption1.5
exhaust
m³/min
1.5
1.5
1.5
size
mm
580*910*1650
580*910*1650
580*910*1650
weight
kg
500
500
500
Detail
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board supplier
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board factory
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board supplier
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board details

Features:

√ Blade database management
√ Workpiece cutting database management
√ Auto focus function
√ Two-way lifting knife cutting function
√ Compensation function for blade exposure
√ Multiple safety guarantees and alarm functions

Conditions of Use:

1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5
3. Please control the water temperature of the cutting water to room temperature 2ºC (fluctuation range within ±1ºC), and control the cooling water temperature to be the same as room temperature (fluctuation range control within ±1ºC).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil
5. Please install this equipment on a waterproof floor and a place with drainage treatment
6. Please operate strictly in accordance with the company's product instruction manual

Application areas:

Diodes, triodes, LED packaging, NTC, MEMS, IC, photovoltaics, medical devices, scintillation crystals

Precision cutting materials

Silicon wafer, PCB board, EMC, ceramics, glass, quartz, gallium arsenide, lithium niobate, sapphire, crystal

Auto focus function:

Through the visual algorithm, coordinated with the motion control, the lens can be automatically raised and lowered, and the clear position of the workpiece image can be quickly obtained
Accessories Consumables
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board factory
Application field
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board supplier
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board details
Factory
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board supplier
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board details
Precision Dicing Machine Can Precisely Cut Quartz, Sapphire, Crystal, PCB Board manufacture

Minder-Hightech

Presents its innovation is latest, the Precision Dicing Machine, the tool that best for precision cutting of an array of materials like quartz, sapphire, crystal, PCB board, and a whole lot. This cutting-edge device is created with advanced technology, made to provide the cuts and this can be sizes are exact and shapes required for different applications

 

 

 

Boasts of high-quality components, insurance firms a motor is useful to achieve consistent and cuts which can be accurate. This product is well matched as much as a variety is broad of, from engineering, manufacturing, development and research to technology and industries being medical

 

 

 

Allows users to cut forms and that can be sizes are complex using its easy-to-use program. The machine are tailor-made having a range of cutting blades, according to the depth and product required

 

 

 

Includes a water is system integral which prevents overheating during prolonged usage. The water system also ensures the cutting blade stays cool and sharp, increasing its lifespan and effectiveness is general

 

 

 

Sleek and design is elegant having a build that compact allows for simple positioning within any factory or workspace. The system normally made with an approach is dustproof which guarantees cleanliness and security during usage

 

 

 

Created safety is using mind along with its enhanced functions. It really a crisis end function that permits a shutdown is instance this instant of emergencies

 

 

 

Highly dependable, with zero-maintenance costs, ensuring you may spend less and length of time when you look at the run is very long. Its durability means it may withstand long hours of continuous usage without showing indications of strain

 

 

 

Spend money on a Minder-Hightech Precision Dicing Machine and enjoy efficiency, accuracy, and durability all in a today is single

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