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  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis
  • Reactive ion etching system RIE machine RIE Failure analysis

Reactive ion etching system RIE machine RIE Failure analysis

Product Description 
Reactive ion etching system
Reactive ion etching system RIE machine RIE Failure analysis supplier
Application
Passivation layer: SiO2, SiNx
Backsilicon
Adhesive layer: TaN
Through hole: W
Feature
1.  Etching of passivation layer with or without holes;  
2. Etching of adhesive layer;  
3. Back silicon etching
Specification
Project configuration and machine structure diagram
Item
MD150-RIE
MD200-RIE
MD200C-RIE


Product size
≤6 inches
≤8 inches
≤8 inches


RF power source
0-300W/500W/1000W Adjustable, automatic matching


Molecular pump
-/620(L/s)/1300(L/s)/Custom

Antiseptic620(L/s)/1300(L/s)/Custom

Foreline pump
Mechanical pump/dry pump

Dry pump

Process pressure
Uncontrolled pressure/0-1Torr controlled pressure


Gas type
H/CH4/O2/N2/Ar/SF6/CF4/
CHF3/C4F8/NF3/Custom
(Up to 9 channels, no corrosive & toxic gas) 

H2/CH4/O2/N2/Ar/F6/CF4/ CHF3/C4F8/NF3/Cl2/BCl3/HBr(Up to 9 channels) 

Gas range
0~5sccm/50sccm/100sccm/200sccm/300sccm/500sccm/custom


LoadLock
Yes/No

Yes

Sample tem control
10°C~Room tem/-30°C~100°C/Custom

-30°C~100°C /Custom

Back helium cooling
Yes/No

Yes

Process cavity lining
Yes/No

Yes

Cavity wall tem control
No/Roomtem~60/120°C

Room tem-60/120°C

Control System
Auto/custom


Etching material
Silicon-based:Si/SiO2/SiNx. 
IV-IV: SiC
Magnetic materials/alloy materials
Metallic material: Ni/Cr/Al/Au. 
Organic material: PR/PMMA/HDMS/Organic film. 

Silicon-based: Si/SiO2/SiNx. 
III-V(注3): InP/GaAs/GaN. 
IV-IV: SiC
II-VI (注3): CdTe. 
Magnetic materials/alloy materials
Metallic material: Ni/Cr/A1/Au. 
Organic material: PR/PMMA/HDMS /organic film. 

1. Prevent chips from flying
2. Minimum node that can be processed: 14nm:
3. SiO2/SiNx etching rate: 50~150 nm/min;
4. Etched surface roughness:5.  Support passivation layer, adhesion layer and back silicon etching;
6. Selection ratio of Cu/Al:>50
7. All-in-one machine LxWxH: 1300mmX750mmX950mm
8. Support one-click execution
Process result

Silicon-based material etching

Silicon-based materials, nano-imprint patterns, array
patterns and lens pattern etching
Reactive ion etching system RIE machine RIE Failure analysis factory

InP normal temperature etching

Pattern etching of InP based devices used in optical communication, including waveguide structure, resonant cavity structure.
Reactive ion etching system RIE machine RIE Failure analysis supplier

SiC material etching

Suitable for microwave devices, power devices, etc.


Reactive ion etching system RIE machine RIE Failure analysis details

Physical sputtering, etching Organic materiale tching

It is applied to the etching of difficult to etch materials such as some metals (such as Ni / Cr) and ceramics, and the
patternede tching.
It is used for etching and removal of organic compounds such as photoresist (PR)/ PMMA / HDMS / polymer
Reactive ion etching system RIE machine RIE Failure analysis factory
Display of failure analysis results
Reactive ion etching system RIE machine RIE Failure analysis manufacture
Product details 
Reactive ion etching system RIE machine RIE Failure analysis details
Reactive ion etching system RIE machine RIE Failure analysis manufacture
Reactive ion etching system RIE machine RIE Failure analysis supplier
Reactive ion etching system RIE machine RIE Failure analysis factory
Reactive ion etching system RIE machine RIE Failure analysis manufacture
Reactive ion etching system RIE machine RIE Failure analysis factory
Packing & Delivery 
Reactive ion etching system RIE machine RIE Failure analysis factory
Reactive ion etching system RIE machine RIE Failure analysis details
soldering machine
Company Profile

The Minder-High-tech Reactive Ion Etching (RIE) machine is a state-of-the-art piece of technology that can etch and analyze various types of materials with incredible precision. This machine is designed for use in various industries where microfabrication or etching is required regularly. It is made from high-quality materials that make it durable, reliable and able to produce excellent results. 

 

Equipped with a RF plasma generator is effective. The RIE system uses a coupling is inductive to come up with plasma from the feed gasoline. This technique creates a plasma is high-density that increases the etch rate associated with product. The etching process of the RIE machine is effective, accurate, and highly controllable, allowing for a depth is specific of to be accomplished. This feature is unique it a great choice for research or industry works. 

 

The machine has a range is wide of, including microelectronics, MEMS fabrication, and semiconductor fabrication. This machine plays an important role in etching and micromachining of semiconductor materials like silicon, gallium arsenide, and germanium in the semiconductor industry. The Minder-High-tech RIE device has additionally been established in the MEMS industry for fabricating soft and materials that are hard as polyimide, silicon dioxide, and silicon nitride. Additionally, it is accessible for failure analysis in industries associated with services and products that are electronic. 

 

Includes features which are various make it easy to utilize. It's a software is user-friendly supplies the operator complete control over the etching parameters utilized in the device. The machine settings are saved to its memory is internal it can store over 100 sets of settings. A touch is had by it screen which allows the operator setting parameters like gas movement, power thickness, and pressure. The Minder-High-tech RIE machine also has a temperature control feature that ensures that the materials are etched at the right temperature and stops damage to them. 

 

Perfect for companies that require a reliable and machine is efficient can provide accurate and precise outcomes. This device has been designed with top-notch technology and a level is a lot of. Its versatility and user-friendly features make it a choice is very good research and industry applications across different sectors. 

 

It also has an efficient failure analysis system that enables the machine to detect and correct any mechanical issues as soon as possible. This system ensures that the RIE machine maintains high quality and reliability throughout its life cycle. For any industry that requires precise and efficient etching or microfabrication, the Minder-High-tech RIE machine is the perfect solution.


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