Semiconductor Advanced Packaging equipment Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine , China Semiconductor Advanced Packaging equipment Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine Manufacturers, Suppliers, Factory

Product Description

Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine

Suitable for the packaging process of high-precision multi chip SMT;
Suitable for bonding substrates and chips in COB/COC processes, through adhesive solidification process and heating eutectic process;
Linear dual drive gantry structure, high-precision CCD recognition and positioning system, ensuring mounting accuracy;
Automatic replacement of suction nozzle or dipping head for sticker opening, achieving multi chip solidification and eutectic;
Chip incoming materials are compatible with standard 2-inch chip boxes, 8-inch and 6-inch wafers, which can achieve automated loading and unloading functions;
Configurable substrate loading and unloading tracks, combined with external equipment to form a continuous production line.

Main functional components：

1. Gantry System XYZ
2. Bonding head component (including sticker head, binocular CCD), adhesive head
3. Feeding track
4. Wafer silo
5. Wafer loading and unloading system
6. Top needle system
7. Chip box placement table
8. Positive recognition calibration table
9. Dipping tray
10. Precision calibration components (calibration board, pressure sensor)
11. Looking up recognition CCD
12. Suction nozzle library

Dual drive gantry system:

Double drive gantry structure, large span, long stroke, XY stroke range 600x600mm.
Dual drive linear motor drive, internationally advanced control system, high position accuracy, positioning accuracy of 2um, repeatability of ± 0.5um.
Marble pedestal ensures equipment stability.

Bonding head component:

The bonding head is installed on the Z-axis, and its up and down movements are driven by precision screws and servo motors;
Binocular CCD, capable of self recognition with a minimum chip size of 0.1mm x 0.1mm and a maximum field of view range of 5x5MM;
Rotating the bonding head can achieve automatic replacement of the suction head, with a pressure control range of 20~200g;
Glue dispensing system, with optional syringe dispensing or spray head.

Incoming material processing platform:

* Standard configuration:
1. Look up recognition CCD
2. Front recognition calibration table
3. Suction nozzle storage
4. Pressure calibrator
5. Calibration board
* Optional configuration:
1. Assembly line track
2. Chip placement table
3. Wafer warehouse and loading/unloading mechanism
4. Dipping tray
5. Eutectic stage (constant temperature or pulse heating)
6. Assembly line+loading and unloading system

Pulse current heating control system:

1. Temperature control, using thermocouple closed-loop control and online real-time feedback to improve the accuracy of
temperature control. With constant temperature control, the temperature control accuracy can reach 1%;
2. Adopting advanced segment control temperature control system, the heating status of each segment can be flexibly set. Can control temperature, time and other parameters with high precision:
3. Fast response, inverter frequency (4kHz), minimum period of power on time control of 0.25ms, using millisecond level:
4. It has fault diagnosis and alarm functions such as temperature abnormality, monitoring value exceeding limit, network voltage exceeding limit, overheating, etc.:
5. Two end heating setting, with temperature gradual rise and fall function, wide time range setting (0-99s);
6. The temperature rises rapidly and steadily, and the local instantaneous heating method can effectively suppress the thermal impact on surrounding components.

Specification

Overall dimensions of the equipment:	1260x1580x1960(mm)
Overall weight of the equipment:	1500KG
Voltage:	220V
Axis repeat positioning accuracy:	±1um
SMT accuracy (standard block):	±1.5um
Surface mount angle accuracy (standard block):	+0.15°
Chip size:	0.2~10mm
Power:	8 KW
Air pressure:	0.4~0.6MP
Solid crystal pressure:	20g
Angle resolution accuracy:	士0.001°~700g

Packing & Delivery

Company Profile

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014，the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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Semiconductor Advanced Packaging equipment Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine