Semiconductor industry RIE PLASMA PR removal machine Photoresist Residual Removal , China Semiconductor industry RIE PLASMA PR removal machine Photoresist Residual Removal Manufacturers, Suppliers, Factory

Product Description

RIE PLASMA Photoresist Remover

Silicon carbide etching
Surface cleaning after etching
DESCUM
Hard mask layer, dry removal
Silicon oxide or silicon nitride etching
Removal of optical resistance between media
Surface residue removal

Semiconductor industry RIE PLASMA PR removal machine Photoresist Residual Removal details

Process

Semiconductor industry RIE PLASMA PR removal machine Photoresist Residual Removal factory

Semiconductor industry RIE PLASMA PR removal machine Photoresist Residual Removal manufacture

Advantage:

Core Advantage

High degumming rate: High-density plasma, fast degumming rate
Stability: After plasma treatment, high reproducibility
Remote plasma: Remote plasma, low ion damage to wafer
Featured software: independent research and development of software, intuitive process animation, detailed data and records
Uniformity: Plasma can control pressure and temperature through butterfly valve
Safety factor: Low plasma reduces damage to product discharge.
After-sales service: Fast response and sufficient inventory
Dust control: Meet customer requirements.
Core technology: With nearly 40% of the R&D team members

Cassette Platform (MD-ST 6100/620)

1. 4 Wafer Carriers
2. High compatibility: the flexibility of wafer size selection brings high cost and solution efficiency
3. High stability vacuum transfer chamber:
The mature and stable vacuum transmission design has been maturely applied in the market for many years and is well recognized by customers.
Turntable design, compact space, significantly reducing the risk of PARTICAL
4. Humanized software operation interface:
Intuitive humanized software operation interface, real-time monitoring of machine running Status;
Comprehensive alarm and fool-proof functions to avoid mis-operation.
Powerful data export function, records of various process parameters, and export of product production records.

Robot

1. One time dual wafer pick and place design brings high productivity
2. Improve space efficiency.

Heating Plate

1. High-precision temperature control wafer plate
Wafer heating plate from room temperature to 250°C, temperature control accuracy ±1°C
Wafer heating plate has been calibrated by professional instruments, and the uniformity. Within ±3°C, ensure the uniformity of glue removal
2. Single-chamber dual-wafer processing
Single-chamber dual-wafer design;
Independent power discharge design for each wafer, ensuring that each wafer. Round PR removal effect;
Under the premise of ensuring UPH efficiency, reduce product cost. Strong compatibility
3. Production capacity: double-piece design reaction chamber, high production efficiency.

Specification

PLASMA source			RF
Power	ICP	_
Power		BIAS	1000W(option)
Applicable scope			4~8 inch
Single processing slice count			1
Appearance dimensions			850mmx900mmx1850mm
System control			PLC
Automation level			Manual

Hardware Capability
Uptime/Available time	≧95%
Mean time to clean （MTTC）	≦6 hours
Mean time to repair（MTTR）	≦4 hours
Mean time between failures（MTBF）	≧350 hours
Mean time between assistant（MTBA）	≧24 hours
Mean wafer between broken（MWBB）	≦1 in 10,000 wafers
Heating plate control	50-250°

Test Report

Semiconductor industry RIE PLASMA PR removal machine Photoresist Residual Removal supplier

Factory View

Packing & Delivery

Company Profile

We have 16 years of experience in equipment sales. We can provide you withone-stop Semiconductor frontend and back end Package Line Equipments solution from China!