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  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum
  • Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum

Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum

Products Description
    The design basis of the MDVES400 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.
   The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.
Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum manufacture
Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum details
Application
IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.
Feature
1.  MDVES400 is a cost-effective product with a small footprint and complete functions, which can meet customer R&D and initial production use;
2.  The standard configuration of formic acid, nitrogen and nitrogen-hydrogen gas can meet the gas demand of various products of customers, without the trouble of adding process gas pipeline for the follow-up;
3.  Adopting water cooling control can increase the cooling rate, so that the production rate can be increased and the production can be maximized; 4. When the customer relates to the vacuum sealing of the tube shell, the water cooling design will highlight the advantages and avoid the air cooling caused by the tube sheet and The puncture problem of the tube shell;
Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum supplier
Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum supplier
Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum details
Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum manufacture
Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven for solder IGBT MEMS vacuum soldering oven Contact Soldering With Vacuum manufacture
Specification
structure size

Basic frame
1260*1160*1200mm

Maximum height of base
90mm

Observation window
include

Weight
350KG

Vacuum system

Vacuum pump
Vacuum pump with oil pollution filtering device optional dry pump

Vacuum level
Up to 10Pa

Vacuum configuration
1. Vacuum pump
2. Electric valve

Pumping speed control
The pumping speed of the vacuum pump can be set by the host computer software

Pneumatic system

Process gas
N2, N2 / H2 (95% / 5%), HCOOH

First gas path
Nitrogen/nitrogen-hydrogen mixture (95%/5%)

Second gas path
HCOOH

Heating and cooling system

Heating method
Radiant heating, contact conduction, heating rate 150℃/min

Cooling method
Contact cooling, the maximum cooling rate is 120℃/min

Hot plate material
copper alloy, thermal conductivity: ≥200W/m·℃

Heating size
420*320mm

Heating device
Heating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is
controlled by the host computer Advantech.

Temperature range
Max 450℃

Power requirements
380V, 50/60HZ three-phase, maximum 40A

Control System
Siemens PLC + IPC

Equipment power

Coolant
Antifreeze or distilled water
≤20℃

Pressure:
0.2~0.4Mpa

coolant flow rate
>100L/min

Water tank water capacity
≥60L

Inlet water temperature
≤20℃

Air source
0.4MPa≤air pressure≤0.7MPa

Power supply
single-phase three-wire system 220V, 50Hz

Voltage fluctuation range
single phase 200~230V

Frequency fluctuation range
50HZ±1HZ

Equipment power consumption
about 18KW; grounding resistance ≤4Ω;

Standard configuration
Host system
including vacuum chamber,main frame, control hardware and software
Nitrogen pipeline
Nitrogen or nitrogen/hydrogen mixture can be used as process gas
Formic acid pipeline
Bringing formic acid into the process chamber via nitrogen
Water cooling pipeline
cooling the upper cover, lower cavity and heating plate
Water cooler
Provide continuous water cooling supply to equipment
Vacuum pump
Vacuum pump system with oil mist filtration
Operation Conditions
Temperature
10~35℃

Relative humidity
≤75%

The environment around the equipment is clean and tidy, the air is clean, and there should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause conduction between metals.




The Minder-Hightech Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven is the ideal item for people looking for perfect soldering outcomes. The oven is specifically developed towards deal with IGBT and MEMS vacuum soldering procedures, guaranteeing outcomes that surpass market requirements.


Geared up along with advanced vacuum innovation, which implies that every soldering treatment creates an outcome is spotless. The vacuum cleaner innovation assists towards eliminate oxygen coming from efficiently the soldering atmosphere, which as a result visits oxidation of the soldering products and semiconductor aspects, offering a guard coming from ecological contamination.


Includes a roomy cavity is single a durable building, guaranteeing that the cleanser and temperature level setups are enhanced for every single soldering procedure. The oven is developed towards reflow a variety is broad of kinds and styles while providing constant first-class outcomes.


Provides flexibility in procedure, allowing individuals towards control the temperature level setups in simply a range of 300 towards 500°C. The temperature level variety setups can be rapidly and quickly personalized towards suit private requests utilizing the programmable operator is temperature level.


Has a get in touch with is distinct ability, where soldering is carried out along with vacuum problems, practically getting rid of any type of variance in the soldering outcomes that may have been actually triggered by fuel bits created through the soldering procedure.


Has an energy-saving innovation, which guarantees very little energy usage while decreasing the cost of soldering and sustainability is enhancing. It is particularly created towards ensure durability and resilience because it truly is developed along with top quality products which can be appropriate for severe production environments.


Functions a user interface is easy to use is certainly not difficult towards run. A comprehensive individual handbook is roofed towards direct individuals on simply ways to run the oven, guaranteeing that individuals acquire a smooth and expertise is simple and easy.


If you are appearing for a vacuum soldering oven that creates high-grade soldering outcomes each time, the Minder-High-tech Semiconductor MDVES400 Single Cavity Vacuum Reflow Oven is the ideal option. Along with its own top-quality building, energy-saving innovation, and a variety of adjustable temperature level setups, it provides constant and remarkable soldering outcomes each time.


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