Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine , China Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine Manufacturers, Suppliers, Factory

Product Description

Automatic TO Laser tube wire bonder MD-KTO94

1. The machine is suitable for TO56 laser diode packaging

For TO56 laser diode vertical and side welding, automatic loading and unloading welding equipment.

2. High compatibility
Welding TO56 laser diode, long and short pin compatible. Front side welding.

3. High stability
Bangtou adopts the optical deletion ruler imported from Germany and the most advanced voice coil motor, the welding action is high speed and stable.

4. High processing speed
Welding cycle: 80ms/W

Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture

Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine details

Specification

Visual system
Machine vision lens:	1.8 times
Stereomicrolens:	15 times, 30 times
Ring lighting:	White super bright LED light with adjustable brightness
Working light:	Maximum power 3W
pelletizing
Lighting method:	Negative electrons spark into balls
Ball burning time:	0~25.5ms
Bulb burning current:	0~20mA
Ultrasonic generator	Ultrasonic power 0 ~ 1.0 W
Welding time:	(1) First welding time: 0~255ms (2) Second welding time: 0~255ms
Ultrasonic frequency	138KHz
Welding process frequency regulation	Automatically capture and track the resonant frequency of the transducer

Equipment details

Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine factory

Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine supplier

Our Factory

To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.

Packing & Delivery

We have 16 years of experience in equipment sales ，

and can provide you with a one-stop IC Package Line Equipment solution

Presenting the Minder-Hightech Semiconductor Manufacturing Automatic TO Package Wire Bonder Laser device Diode Product packing Ultrasonic Gold Wire Sphere Bonding Machine. This cutting-edge machine is the ideal service for business in the semiconductor market searching for a quick and dependable method towards package their items.

Geared up along with improved features that create it much a lot extra effective and easy to use compared to various other devices which can be comparable the market.
This machine is truly a flexible service for the product packing needs along with automatic TO product packing, wire bonding, and laser device diode product packing abilities.

Among the standout functions is its own ultrasonic gold cable television sphere innovation is bonding. This enables a solid and bond is continuous the wire and gadget, creating specific your item is resilient and protect. Furthermore, the gadget has a huge location is functioning allowing a high throughput and quicker manufacturing opportunities.

Extremely user-friendly, due to its own user interface is manages and user-friendly. The machine likewise includes safety is different, like for example interlocks and alarm systems, that guarantee your drivers are safeguarded throughout utilize.

In concerns towards dependability and resilience, the Minder-Hightech gadget examinations all of the packages. It is developed along with top quality products and innovation is progressed create it immune towards tear and use. This implies you are capable towards rely on the gadget towards provide results that are constant likewise after a number of years of utilization.

Certainly not simply effective and dependable, however furthermore it is a service is environmentally-friendly. The gadget is developed towards reduce squander and decrease power usage, creating it a choice is fantastic business wanting to decrease their carbon dioxide impact.

The Minder-Hightech Semiconductor Manufacturing Automatic TO Package Wire Bonder Laser device Diode Product packing Ultrasonic Gold Wire Sphere Bonding Machine is a high-grade service for business in the semiconductor market. Along with its own progressed functions, simplicity of utilization, and dependability, this machine is a financial investment that will settle in the long term. Therefore, why hang around? Get in touch with Minder-Hightech today to find out more around their advanced machine and get your semiconductor manufacturing towards the following degree.