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  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber
  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber
  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber
  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber
  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber
  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber
  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber
  • Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber

Semiconductor substrate Wafer manufacture Equipment Fully Automatic single Chip Wafer Cleaning Machine Wafer Scrubber

Product Description

Fully Automatic Single-chip Wafer Cleaning Machine Wafer Scrubber

Machine features

Single cavity, two cavity, and four cavity
Strong process capability, capable of supporting applications such as Wafer Start and process cleaning
Good consistency of equipment inter chip technology

Application Fields

Surface particle removal of 4-8 inch silicon-based and compound based wafers

Technical parameters

4-inch, 6-inch, 8-inch brush cavity
Spinner speed up to 4000RPM
Dual Arm brush chamber, available in Brush, AS, JET, Megasonics cleaning methods
Can support liquid cleaning function

LoadPort unit, loading unit

LoadPort is the loading unit of this device
Capable of Wafer Mapping
Equipped with Wafer slide detection

Transfer Robot unit

Dual Blade Robot, optional with vacuum or tray type Blades.

Alignment and flipping unit

Can align and locate flat edges
Wafer can be flipped to scrub the crystal back

Brushing unit

Brushing Arm Quantity * 2
Wafer handle: Chuck clamp or suction type
Brush, AS, JET, Megasonics cleaning modes, supporting pharmaceutical cleaning
1. Supports Wafer input and out put simultaneously, as well asA input and B output modes
2. Can support brushing the front of chamber A andthe back of chamber B
3. Can support dual chamber parallel cleaning

Brush unit description

As shown in the figure
Wafer fixed on top of Spinner
Arm1&Arm2 can be used in conjunction with various brushing methods described earlier to clean wafers.
After cleaning, Spinner rotates at high speed to spin and dry the wafer

Alignment and flipping unit

Wafer can be used for residential and leveling purposes
Wafer can be flipped
Equipment size: 160x150x220 (mm)
Loading and unloading methods: same in and same out&A in and B out
Number of brushing units: 2
Brushing modes: Brush, AS, JET, Megasonics cleaning methods, supporting pharmaceutical cleaning
Packing & Delivery
Company Profile
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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