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  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine
  • Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine

Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine

Product Description
Manual Epoxy die bonder
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Feature
1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice
character, etc.
2. Realize the soft contact of the suction nozzle, effectively solve the problem of the active area such as the air bridge on the surface of the GaAs chip
3. Non-damage flattening adjustment for uneven patch or large-sized chips
4. Dispensing and patch are integrated, integral, convenient or double-head patch function, improve efficiency
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine manufacture
Specification
Function:
Automatic scribing, dispensing, sticking
Bonded Chip Size:
0.2-25mm
Adhesive pressure:
10-150g
Lifting table size:
X-Y:250*270mm Z:18m
Control platform effective travel:
X-Y:10mm*10mm Z:25mm
Motion Control Platform Accuracy:
0.2um
Nozzle rotates 360°
Chinese self-naming parameter file name storage, easy to remember
With automatic height detection function
Later upgradeable epoxy eutectic machine
Parameters
power supply:
AC220V±10%,50-60HZ,≤400W
Compressed air>=0.5MPa
Vacuum pipeline <-0.08MPa
External dimensions:
800*380*450mm
weight:
70KG
stable workbench keep away from vibration sources
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine supplier
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine manufacture
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine supplier
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine details
Packing & Delivery
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine supplier
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Company Profile

Echnical Services

There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine factory
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine details
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine manufacture
Small Chip Manual Packaging Equipment for Laboratories Die bonder Die bonding machine manufacture

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