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  • Vacuum eutectic reflow soldering oven system vacuum soldering furnace
  • Vacuum eutectic reflow soldering oven system vacuum soldering furnace

Vacuum eutectic reflow soldering oven system vacuum soldering furnace

Products Description
Vacuum pack system
Vacuum eutectic reflow soldering oven system vacuum soldering furnace factory
Vacuum eutectic reflow soldering oven system
* Product description: Vacuum eutectic reflow soldering oven system
Application
IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.  
Product description
The design basis of the MDVES200 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.
The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.
MUX200 is a 10L cavity, the cost performance of the product is relatively high, which can meet the needs of research and production customers.
Feature
1. MDVES200 is a cost-effective product with a small footprint and complete functions, which can meet customer R&D and initial production use;  
2. The standard configuration of formic acid, nitrogen and nitrogen-hydrogen gas can meet the gas demand of various products of customers, without the trouble of adding process gas pipeline for the follow-up;  
3. Adopting water cooling control can increase the cooling rate, so that the production rate can be increased and the production can be maximized;
4. When the customer relates to the vacuum sealing of the tube shell, the water cooling design will highlight the advantages and avoid the air cooling caused by the tube sheet and The puncture problem of the tube shell;  
Specification
structure size

Basic frame
820*820*1000mm

cavity volume
10L

Maximum height of base
110mm

Observation window
include

Weight
220KG

Vacuum system

Vacuum pump
Vacuum pump with oil pollution filtering device

Vacuum level
Up to 5Pa

Vacuum configuration
1. Vacuum pump
2. Electric valve

Pumping speed control
The pumping speed of the vacuum pump can be set by the host computer software

Pneumatic system

Process gas
N2, N2 / H2 (95% / 5%), HCOOH

First gas path
Nitrogen/nitrogen-hydrogen mixture (95%/5%) 

Second gas path
HCOOH

Heating and cooling system

Heating method
Radiant heating, contact conduction, heating rate 150℃/min

Cooling method
Contact cooling, the maximum cooling rate is 120℃/min

Hot plate l
materia copper alloy, thermal conductivity: ≥200W/m·℃

Heating size
240*210mm

Heating device
Heating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is controlled by the host computer Advantech. 

Temperature range
Max 400℃

Power requirements
380V, 50/60HZ three-phase, maximum 40A

Control System
Siemens PLC + IPC

Equipment power

Coolant
Antifreeze or distilled water
≤20℃

Pressure:
0.2~0.4Mpa

coolant flow rate
>100L/min

Water tank water capacity
≥60L

Inlet water temperature
≤20℃

Air source
0.4MPa≤air pressure≤0.7MPa

Power supply
single-phase three-wire system 220V, 50Hz

Voltage fluctuation 
range single phase 200~230V

Frequency fluctuation range
50HZ±1HZ

Equipment power 
consumption about 5KW; grounding resistance ≤4Ω;

Standard configuration
 Host 
system including vacuum chamber,main frame, control hardware and software
Nitrogen pipeline
Nitrogen or nitrogen/hydrogen mixture can be used as process gas
Formic acid pipeline
Bringing formic acid into the process chamber via nitrogen
Water cooling 
pipeline cooling the upper cover, lower cavity and heating plate
Water cooler
Provide continuous water cooling supply to equipment
Vacuum pump
Vacuum pump system with oil mist filtration
Operation Conditions
Temperature
10~35℃

Relative humidity
≤80%

The environment around the equipment is clean and tidy, the air is clean, and there should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause conduction between metals. 

Presenting the Vacuum Eutectic Reflow Soldering Oven System coming from Minder-Hightech, the ideal service for all of your soldering requirements. This cutting-edge vacuum soldering furnace is developed towards guarantee dependable and effective soldering outcomes for all of your digital elements.


Along with its own greater degree innovation, it is efficient at offering steady temperature level command, high thermal efficiency, and soldering efficiency is outstanding. Its own smart PID temperature level command system assurances accurate and temperature level is precise, allowing you towards solder elements along with simpleness.


Can likewise be developed along with a vacuum is top quality that guarantees a tidy soldering atmosphere, eliminating any type of pollutants that might impede the soldering procedure. The furnace is produced along with high-quality products, guaranteeing its own protection and resilience towards rust. This creates it ideal for enduring utilize and manufacturing is requiring.


Simple towards run, in addition to its own electronic command system provides a user interface is user-friendly allows you towards easily screen the development of the soldering procedure. The system likewise sustains dish is various, ensuring your soldering setups can be just conserved, enhanced, and recovered for potential use.


Perfect for your demands whether you are an expert digital manufacturer or even possibly a hobbyist. Its own flexible and style is reliable appropriate for a wide variety of requests, consisting of semiconductor product packing, Light-emitting Diode production, MEMS much a lot extra, and product packing.


Along with its own top quality vacuum bodies, effective styles, and progressed temperature level manages steps, the Minder-Hightech Vacuum Eutectic Reflow Soldering Oven System is the best services for all of your soldering requirements. Its own resilient building, user-friendly user interface, and remarkable efficiencies create it an innovator in the market, providing unparalleled worth for your financial assets. Do not hang around any type of much a lot longer, attempt it out currently.

 


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