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  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320
  • Vertical grinder wafer back grinder MDFD-320

Vertical grinder wafer back grinder MDFD-320

Product Description

Vertical grinder MDFD-320

It is made from sucker, sucker main axis, grinding wheel, grinding wheel main axis, and driving part and guide screw etc.
Sucker: can be chosen to electromagnetism sucker or vacuum sucker, sucker diameter can be 320mm-600mm.
Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary, speed 3-140 adjustable.
Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the granularity (roughness) of the grinding wheel is depend on the process.
Grinding wheel main axis: frequency control of motor speed, 3000-8000 adjustable.
Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable, it is checked by grating ruler.
This machine is very easy for operator
Vertical grinder wafer back grinder MDFD-320 manufacture
Vertical grinder wafer back grinder MDFD-320 supplier
Vertical grinder wafer back grinder MDFD-320 factory
Vertical grinder wafer back grinder MDFD-320 supplier
Application
Mainly used at silicon wafer, ceramic, glass, quartz crystal, sapphire, semiconductors precision thinning (grinding)。
Sample
Vertical grinder wafer back grinder MDFD-320 factory
Vertical grinder wafer back grinder MDFD-320 factory
Vertical grinder wafer back grinder MDFD-320 details
Vertical grinder wafer back grinder MDFD-320 details
Specification
Sucker  chucktable
D320-D600
Main motor
2.2kw 0-280RPM
Grinding wheel
D150-D200
Feed motor
750w
Workpiece Thickness b
0.8
Spindle
4kw/3000-8000RPM
Flatness
+-2um(50*50)
Sand pump motor
250w
Best workpiece diameter
D50
Grating system
0.001mm
Location accuracy
3um
Dimension
1125*2000*1750mm
Working station
depending
Weight
700kg
air source
0.6mpa
power
380v*3
Details Images
Vertical grinder wafer back grinder MDFD-320 details
Vertical grinder wafer back grinder MDFD-320 factory
Factory
Vertical grinder wafer back grinder MDFD-320 supplier
Vertical grinder wafer back grinder MDFD-320 details
Vertical grinder wafer back grinder MDFD-320 supplier
Vertical grinder wafer back grinder MDFD-320 factory
Customer use
Vertical grinder wafer back grinder MDFD-320 details
Vertical grinder wafer back grinder MDFD-320 manufacture
Packing & Delivery
Vertical grinder wafer back grinder MDFD-320 factory
Vertical grinder wafer back grinder MDFD-320 details

Minder-Hightech's Vertical Grinder Wafer Back Grinder MDFD-320 is an innovative and efficient gadget in the world of wafer back grinders. This product stands apart for its own design, higher leading efficiency, and costs. Its own unique vertical configuration produces it easy to use, allowing efficient introducing and discharging of wafers, and its own advanced grinding development produces it effective in achieving remarkable results.


Amongst the overview is the stable and accurate therapy is grinding it offers. This might be because of the use of ruby grinding tires, which reduce the danger of breaking and ensure a surface area surface is amazing. Designed together with a cooling off is advanced, which prevents obtaining as well warm and suggests that the grinding therapy is performed at a continuous, handled temperature level degree.


Another profit is its own versatility, because it can treatment all of kinds of wafers, originating from little bit of towards huge measurements, and originating from slim towards thick. The gadgets can suit wafers as long as 320mm in dimension and has presently a thickness been actually grinding of 50-500 microns. Additionally, this has advanced features such as automated gadget resettlement, which reduces the demand for handbook adjustments, and a chauffeur is user-friendly, which allows you towards operate and protect.


Designed together with security in thoughts. It really is tailored up together with safety actions such as problem factor changes, interlocks, and offers keeping that are safety ensure the safety of the chauffeur and device. The vertical configuration of the device additionally reduces the risk of accidents, since it decreases the opportunity of chauffeur guide exposure towards dirt is grinding coolant.


The Minder-Hightech Vertical Grinder Wafer Back Grinder MDFD-320 is a game-changer in the wafer back grinding market. Whether you are producing little bit of and even huge strength batches our quick gadgets offer precise and continuous results each opportunity.


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