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  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine
  • Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine

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Application

Suitable for: SMD HIGH-POWER COB,part COM in-line package etc.

1, Full automatic up load and down load materials.
2, Module design,max optimization structure.
3, Full intellectual property right.
4, Picking die and Bonding die dual PR system.
5, Multi-wafer ring,dual glue ect configuration.Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factoryDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine detailsDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine detailsDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufactureDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplierSpecification
Bonding workstage

Load ability 1 piece
XY stroke 10inch*6inch(working range 6inch*2inch)
Accuracy 0.2mil/5um
Dual work stage can feed continuously

Wafer workstage

XY travel stroke 6inch*6inch
Accuracy 0.2mil/5um
Wafer position accuracy +-1.5mil
Angle accuracy +-3 degree
Die dimension 5mil*5mil-100mil*100mil
Wafer dimension 6inch
Picking up range 4.5inch
Bonding force 25g-35g
Multi wafer ring design 4 wafer ring
Die type R/G/B 3type
Bonding arm 90degree rotary
Motor AC servomotor
Image recognition system

Method 256 gray scale
Check ink dot,chipping die,crack die
Display screen 17inch LCD 1024*768
Accuracy 1.56um-8.93um
Optics magnification 0.7X-4.5X
Bonding cycle 120ms
Number of program 100
Max die number on one substrate 1024
Die lost check method vacuum sensor test
Bonding cycle 180ms
Glue dispensing 1025-0.45mm
Die lost check method vacuum sensor test
Input voltage 220V
Air source min.6BAR,70L/min
Vacuum source 600mmHG
Power 1.8kw
Dimension 1310*1265*1777mm
Weight 680kg
DetailDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factoryDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine manufactureDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine detailsDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factoryOur FactoryDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine detailsDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplierPacking & DeliveryDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplierDual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details

The Minder-Hightech Wafer Die Bonder is the perfect choice for any company in need of an efficient and reliable Die Attach bonding machine for in-line package manufacturing. This cutting-edge equipment is designed to deliver superior results with precision and accuracy, making it highly popular among industry professionals. 


Made with durability and functionality in your mind, this consists of tough materials that guarantee exemplary performance and longevity. The device consists of advanced features which make it user-friendly, easy to run, and offer output is consistent. 


With a give attention to innovation and quality, the Minder-Hightech brand has had the opportunity to produce this top-of-the-line bonding machine is equipped with the technology is latest to ensure every bond is completed efficiently. Good for any company excellence is seeking their Die Attach bonding process. 


Among the biggest benefits of this is its accuracy is high and amounts. Its Jetting is advanced Technology that each relationship is made with extreme precision, which reduces mistakes and guarantees constant results.


The device also comes with a vision is advanced, rendering it very easy to spot any defects or anomalies. This allows you to take immediate corrective action, ensuring that your particular product is of the quality is highest possible. 


Another feature is its versatility. It could be utilized with a variety is wide of sizes, ranging from because small as 5mm to as large as 100mm. This offers greater flexibility to allow for application is significantly diffent. 


Designed for easy upkeep, with immediate access to machine elements that need repair or servicing is regular. This means that downtime is minimized, and the machine could be back operation as quickly as possible. 


Get your hands on the Minder-Hightech Wafer Die Bonder today and experience the benefits of this top-quality machine. 


Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Specification
Bonding workstage
Load ability
1 piece
XY stroke
10inch*6inch(working range 6inch*2inch)
Accuracy
0.2mil/5um
Dual work stage can feed continuously
Wafer workstage
XY travel stroke
6inch*6inch
Accuracy
0.2mil/5um
Wafer position accuracy
+-1.5mil
Angle accuracy
+-3 degree
Die dimension
5mil*5mil-100mil*100mil
Wafer dimension
6inch
Picking up range
4.5inch
Bonding force
25g-35g
Multi wafer ring design
4 wafer ring
Die type
R/G/B 3type
Bonding arm
90degree rotary
Motor
AC servomotor
Image recognition system
Method
256 gray scale
Check
ink dot,chipping die,crack die
Display screen
17inch LCD 1024*768
Accuracy
1.56um-8.93um
Optics magnification
0.7X-4.5X
Bonding cycle
120ms
Number of program
100
Max die number on one substrate
1024
Die lost check method
vacuum sensor test
Bonding cycle
180ms
Glue dispensing
1025-0.45mm
Die lost check method
vacuum sensor test
Input voltage
220V
Air source
min.6BAR,70L/min
Vacuum source
600mmHG
Power
1.8kw
Dimension
1310*1265*1777mm
Weight
680kg
Detail
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Our Factory
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine details
Packing & Delivery
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine supplier
Dual head high speed Die Bonder Die attach machine for semiconductor manufacturing machine factory

The Minder-High-tech Wafer Die Bonder is the perfect choice for any company in need of an efficient and reliable Die Attach bonding machine for in-line package manufacturing. This cutting-edge equipment is designed to deliver superior results with precision and accuracy, making it highly popular among industry professionals.

 

Made with durability and functionality in your mind, this consists of tough materials that guarantee exemplary performance and longevity. The device consists of advanced features which make it user-friendly, easy to run, and offer output is consistent.

 

With a give attention to innovation and quality, the Minder-High-tech brand has had the opportunity to produce this top-of-the-line bonding machine is equipped with the technology is latest to ensure every bond is completed efficiently. Good for any company excellence is seeking their Die Attach bonding process.

 

Among the biggest benefits of this is its accuracy is high and amounts. Its Jetting is advanced Technology that each relationship is made with extreme precision, which reduces mistakes and guarantees constant results.

 

The device also comes with a vision is advanced, rendering it very easy to spot any defects or anomalies. This allows you to take immediate corrective action, ensuring that your particular product is of the quality is highest possible.

 

Another feature is its versatility. It could be utilized with a variety is wide of sizes, ranging from because small as 5mm to as large as 100mm. This offers greater flexibility to allow for application is significantly different.

 

Designed for easy upkeep, with immediate access to machine elements that need repair or servicing is regular. This means that downtime is minimized, and the machine could be back operation as quickly as possible.

 

Get your hands on the Minder-High-tech Wafer Die Bonder today and experience the benefits of this top-quality machine.


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