пројекат
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садржина
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Тип производа
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6",8",12" wafer, 2.5D/3D packaging
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2D Inspection
Артикли |
Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive needle marks, etc.
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2D Metrology
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Bump diameter, needle mark coordinates, RDL and TSV metrology, etc.
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3D Inspection Project
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Bump height, Bump coplanality
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Cassette &Transmission Method
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8"SMIF , 12" FOUP or combination
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Објектив и резолуција
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2x(2.75um)13.5x(1.57um)5x(1.1um)17.5x(0.73um)110x(0.55um)
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Прецизност
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0.55um/pixel
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Опционо и прилагођено
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Double sided OCR,3D module, supported by E84
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Ауторско право © Гуангзхоу Миндер-Хигхтецх Цо., Лтд. Сва права задржана