Wafer Scriber Breaker Equipment , China Wafer Scriber Breaker Equipment Manufacturers, Suppliers, Factory

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Wafer Scriber Breaker / Wafer Scribe and Break Equipment

Suitable for specialized equipment for cutting and cleaving compound semiconductor wafer materials such as GaN, GaAs, InP, etc. with a diameter of less than 4 inches. Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.

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Cutting head	X direction	Travel range: 120mm	Roller pressure	0~100gf
	X direction	Positioning accuracy: 5 μ m	Knife pressure	0~20gf
	Y direction	Travel range: 100mm	Equipment weight	About 60kg
	Y direction	Positioning accuracy: ±5 μ m	Lens Y direction	Travel range:650650400mm
T direction		360 degree rotation	External dimensions	1170mmx730 mmx500mm
Wafer size		Suitable for 4-inch (100mm) wafers	Operation interface	19.5 "TFT color screen, Chinese interface
Image system		6.0X magnification (4.0X optional)	Control system	Windows 7 operating system, dedicated control software for cleavage machines
Standard configuration		Host \ Computer \ 19.5 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard